Intel
Module Development Engineer
US, Oregon, Hillsboro · Internship
Sponsorship not specified$134k-$189kDetected 6 days ago
PythonMATLABNode.jsData AnalysisStatisticsSEMElectrical EngineeringResearchExperimental DesignLeadershipCommunicationProblem SolvingPublic Speaking
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odds of building a lasting career here
64Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role100
Entry-level history0
PERM / green-card track0
Lottery odds (Level IV)94
Fits your clock70
Sponsors, but it's cap-subject — you still face the weighted lottery (~61% per draw at Level IV). Good if you win; have a cap-exempt backup on your list.
Lottery odds assume a STEM candidate.
Personalize to your clock →Employer immigration record
from this employer's Department of Labor filings
Green-card filing pattern in this occupation
Context, not a finding about this posting: of this employer's 333 green-card filings in this occupation, 100% were for a worker who already held the job.
Green-card follow-through: 74%
Of 318 labor certifications old enough to have been used, 83 expired without the employer filing the next step. Median time from filing to decision: 508 days.100% of their filings were for a worker who already held the job.Only certifications past the 180-day window are counted — recent ones cannot have expired yet.
Reported a layoff in this occupation
In a green-card filing decided 2026-05-14, this employer stated it had laid off workers in Software Developers (CA) during the preceding six months. 3 such filings on record.Describes the period before that filing, not necessarily today. Unlike WARN notices this is occupation-specific and federal.
Files H-1B transfers
33 transfer filings in the last year, covering 33 workers. Median labor-condition decision: 7 days. An employer that already files transfers is one that can take over an existing H-1B.
Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.
Community outcomes
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About the role
- As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, driving the design and development of advanced manufacturing processes and enabling technologies.
- Your contributions will shape Intel's ability to deliver cutting-edge devices, enhance production efficiency, and influence the future of semiconductor technology.
Responsibilities
- Develop and optimize advanced manufacturing processes including material selection, parameter adjustments, equipment metrology, and system design
- Conduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmaps
- Design and implement modifications to operating equipment to improve efficiency and production output
- Collaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processes
- Perform process technology feasibility studies using theoretical simulations and practical engineering methods
- Drive the development of cost-sensitive technology roadmaps in partnership with vendors and internal stakeholders
- In this role, you will collaborate with world-class teams and industry-leading suppliers to pioneer materials, equipment, and process integration strategies that push the boundaries of technological possibilities.
- By joining Intel, you will have the opportunity to make a profound impact on our technology roadmap and help maintain Intel's leadership in a dynamic and competitive marketplace.
Requirements
- PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experience
- Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials
- Experience with experimental design, data collection, and statistical analysis
- Strong problem solving skills and ability to work independently while collaborating in cross functional teams
- are required to be initially considered for this position.
- Minimum qualifications are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Nice to have
- PhD research focus specifically related to plasma etch, pattern transfer, or advanced logic/memory process integration
- Hands on experience with production or pilot line dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi)
- Knowledge of advanced node challenges such as high aspect ratio etching, CD control, etch selectivity, and damage mitigation
- Experience with Design of Experiments (DOE) and statistical process control (SPC)
- Programming or scripting experience for data analysis or automation (e.g., Python, MATLAB, JMP, or similar tools)
- Exposure to foundry or industrial semiconductor Research and Development environments through internships, collaborations, or joint research programs
- Demonstrated interest in transitioning academic research into high volume manufacturing solutions
- Hands on research experience with dry etch-related topics (e.g., plasma etching, RIE, ICP, ALE) through academic research, dissertation work, or internships
Compensation
- Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
- The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Annual Salary Range for jobs which could be performed in the US:
- $133,800.00-188,890.00 USD
Benefits
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel.
- Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Company info
- We offer a total compensation package that ranks among the best in the industry.
Visa & Work Authorization
- For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
This listing is sourced directly from Intel's careers page and normalized into a canonical job model.