Broadcom

IC Package Thermal Mechanical Engineer

USA-CA Irvine Alton Parkway Bldg 2

Sponsorship not specified$110k-$176kDetected 16 days ago

PythonMATLABMachine LearningLLMsANSYSFEAThermal AnalysisMechanical Design

About the role

This position offers a dynamic balance: 70% advanced simulation and modeling work, and 30% hands-on lab experiments in reliability testing (e.g., Electromigration, Temperature Cycling [TCT], and drop tests).

Advanced Simulation & Modeling (70%): Develop, perform, and validate advanced numerical Finite Element Analysis (FEA) and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
Physics-Driven Design: Apply an in-depth understanding of structural mechanics, fluids, and heat transfer to solve complex chip-package and package-board interaction challenges.
This role focuses on the mechanical design and thermo-mechanical simulation of complex, advanced semiconductor packages used in high-performance computing (HPC), AI, and networking products.
All subject to relevant plan documents and award agreements.
Workflow Automation: Streamline simulation workflows by developing reusable model-generation, post-processing, design-of-experiments (DOE), and reliability-data-analysis tools (Ansys APDL, Python, or MATLAB).

OR a Master's degree with 6+ years
OR a PhD with 3+ years of experience in Mechanical Engineering, Material Sciences, or a related field with an emphasis on solid mechanics.
Ability to evaluate complex numerical simulations against first principles (e.g., strength of materials solutions).
Working knowledge of electromigration and general silicon/IC packaging reliability.
FEA Proficiency: Hands-on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).
Bachelor's degree with 8+ years of relevant industry experience
Hands-on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).

Material Characterization: Hands-on experience performing mechanical testing and utilizing experimental material characterization metrologies (e.g., DMA/TMA, nano-indentation).
Thermal Analysis: Previous thermal engineering background utilizing tools such as Icepak and Flotherm.
Broadcom is proud to be an equal opportunity employer.
We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Previous thermal engineering background utilizing tools such as Icepak and Flotherm.

The annual base salary range for this position is USD 109,700.00 To USD 175,500.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.

Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Experience integrating Machine Learning and Gen-AI applications into engineering workflows is highly desired.
Compensation and Benefits
Leverage Machine Learning, Generative AI, and numerical tools to build automated user interfaces.

consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other

This listing is sourced directly from Broadcom's careers page and normalized into a canonical job model.