Intel

Intel

Packaging Module Equipment Development Engineer

US, Arizona, Phoenix · Internship

Sponsorship not specified$134k-$189kDetected 7 hours ago
PCB DesignMechanical DesignElectrical EngineeringResearchLeadershipCommunicationAdaptability

About the role

  • Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
  • This position requires regular onsite presence.

Responsibilities

  • Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms.
  • Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.

Requirements

  • PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 6+ months of relevant experience
  • Must have the required degree prior to your start date.
  • One or more years of experience in any of the following:
  • You must possess the below minimum qualifications to be initially considered for this position.
  • Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Nice to have

  • Technical leadership, strategic planning, and critical thinking.
  • Tolerance for ambiguity and adaptability in a dynamic environment.
  • Flexibility in managing changing priorities and responsibilities.
  • Experience leading teams in a highly matrixed organization.
  • Initiative and ability to work independently.
  • Strong communication, influencing, technical, and analytical skills.
  • Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
  • Delivering results for complex, time-critical technical projects.

Skills

  • The Packaging Module Development

Compensation

  • $133,800.00-188,890.00 USD
  • The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
  • Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
  • If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Benefits

  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
  • Applying formal education and judgment to solve technical problems.
  • Providing sustaining support for equipment performance and process health in high-volume manufacturing.

Company info

  • We offer a total compensation package that ranks among the best in the industry.

This listing is sourced directly from Intel's careers page and normalized into a canonical job model.