Semtech

Semtech

IC Packaging Design Intern

CAN - Ottawa, ON · Intern · Internship

Sponsorship not specifiedDetected 29 days ago
RecruitingSolidWorksAutoCADCadenceMechanical Design5G/LTEVoIPLeadershipMentoringTolerance Analysis

Stay score

odds of building a lasting career here

37Risky
Cap-exempt (no lottery)0
Sponsors this role80
Entry-level history0
PERM / green-card track0
Lottery odds40
Fits your clock70

Thin sponsorship signal and lottery-bound. A low-probability bet with your clock running. Prioritize cap-exempt roles and proven entry-level sponsors first.

Lottery odds assume a STEM candidate.

Personalize to your clock →

Employer immigration record

from this employer's Department of Labor filings

Green-card filing pattern in this occupation

Context, not a finding about this posting: of this employer's 5 green-card filings in this occupation, 80% were for a worker who already held the job.

Files H-1B transfers

1 transfer filing in the last year, covering 1 worker. Median labor-condition decision: 8 days. An employer that already files transfers is one that can take over an existing H-1B.

Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.

Community outcomes

No reports yet — be the first to help the next applicant.

About the role

  • Our approach to internship is to make the successful candidate an integral part of our team.
  • We understand that it is best to learn through direct involvement and we will provide you with tasks that enable you to learn and to be productive at the same time.
  • The more you learn the more complex your tasks will become.

Responsibilities

  • As the Intern of the IC packaging design team, you will be involved with:
  • Design of IC chip carriers contained in either electronic components or pluggable modules
  • Support our signal integrity experts with layout generation to accelerate 3D electromagnetic simulations as well as thermo-mechanical analysis.
  • This position is for a 12 - 16 month student IC packaging design internship at Semtech Canada with the Signal Integrity Products Group (SIP) in our Ottawa Design Centre

Requirements

  • Experience with advanced manufacturing in electronic would be a strong asset
  • Ability to learn quickly and work independently or in a team environment
  • Experience with tolerance analysis would be an asset
  • Incumbents may be required to perform job-related tasks other than those specifically included in this description.

Skills

  • Using advanced CAD tools, support
  • physical assembly design and mechanical outlines
  • Semtech's dynamic team environment and senior packaging engineers will provide mentoring and guidance throughout the internship term

Compensation

  • Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation package.

Company info

  • Semtech's Signal Integrity Products group designs high performance optical networking product platforms that enable hyperscale data center applications, enterprise networking, wireless infrastructure including 5G networks, and passive optical network/Fibre-to-the-X markets.
  • To put it simply, whenever you use your computer to browse the web or use your smartphone to make a video call, most likely, your data is passing through one of many high-speed component from Semtech.
  • Our experience and expertise contribute to push the boundaries of networking speed, ensuring the best experience for our end users - you!
  • Join us, and together we will continue to build a faster, better, and more secure online world for everyone.

This listing is sourced directly from Semtech's careers page and normalized into a canonical job model.