Flexcompute
Physics AI - Thermal-Mechanical Reliability
Watertown, Massachusetts, United States
Sponsorship not specifiedDetected 131 days ago
Machine LearningFEAMechanical DesignLeadershipCollaboration
About the role
- Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and quantum computing chips.
Responsibilities
- Own the technical roadmap for the thermal-mechanical domain.
- Design end-to-end simulation workflows that address complex 3D-IC challenges, including through-silicon via (TSV) stress, micro-bump reliability, and global package warpage.
- Act as the lead technical partner for world-class semiconductor companies, demonstrating how Flexcompute's speed transforms their iterative design cycles from days to minutes.
- Strategic Leadership: Own the technical roadmap for the thermal-mechanical domain.
- Architectural Innovation: Design end-to-end simulation workflows that address complex 3D-IC challenges, including through-silicon via (TSV) stress, micro-bump reliability, and global package warpage.
- High-Stakes Collaboration: Act as the lead technical partner for world-class semiconductor companies, demonstrating how Flexcompute's speed transforms their iterative design cycles from days to minutes.
- Recruit, mentor, and lead a high-performing team of engineers specialized in computational mechanics and AI-driven physics.
Requirements
- 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time-to-market.
- Directly influence the development of our GPU-accelerated solvers, ensuring they are optimized for the non-linear material behaviors and multi-scale meshes required for advanced packaging.
- Industry Track Record: 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time-to-market.
- Product Influence: Directly influence the development of our GPU-accelerated solvers, ensuring they are optimized for the non-linear material behaviors and multi-scale meshes required for advanced packaging.
Skills
- Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology.
- Our customer base includes both household names and startups in emerging industries.
- Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability.
- In this role, you will be the primary architect of how we apply our world's fastest GPU solvers and Physics
- the structural and thermal integrity of advanced packaging.
Benefits
- Competitive compensation with equity of a fast-growing startup.
- Medical, dental, and vision health insurance.
- Gym allowance.
Apply directly at Flexcompute →Create a free account for alerts like thisView Flexcompute immigration profile
This listing is sourced directly from Flexcompute's careers page and normalized into a canonical job model.