Semtech
Quality Process Engineer - Semiconductor Manufacturing
USA - Colorado Springs - Federal · Director
Sponsorship not specified$75k-$115kDetected 30 days ago
StatisticsA/B TestingSEMAuditingProcess ImprovementSystems EngineeringMedical DevicesLeadershipCommunicationCollaborationProblem SolvingMicrosoft Office
About the role
- This role sits at the intersection of quality engineering and process engineering - combining deep technical knowledge of semiconductor packaging with structured problem-solving to eliminate chronic open corrective actions.
- Your technical credibility in semiconductor packaging will enable you to influence cross-functional teams, facilitate collaborative problem-solving sessions, and ensure corrective actions address true root causes rather than symptoms.
- Over time, this role may also contribute to quality system auditing as the team scales.
Responsibilities
- Own and drive closure of 70+ open corrective action reports (CARs) across engineering, operations, maintenance, and systems engineering through technical problem-solving and cross-functional collaboration
- Lead cross-functional CAR review sessions, bringing together relevant stakeholders to solve problems comprehensively rather than superficially
- Design and execute Design of Experiments (DOE) to identify root causes of process variability and validate corrective actions
- Support qualification and validation of chip-scale packaging processes including flip chip, wafer-level CSP, die attach, molding, and plating operations
- Perform Measurement System Analysis (MSA) and Gage R&R studies to validate inspection and test equipment capability
- Support new product introduction (NPI) through process validation (IQ/OQ/PQ), first article inspection (FAI), and production readiness activities
Requirements
- Bachelor's degree in Engineering, Materials Science, Physics, or related technical field
- 5+ years of quality engineering experience in semiconductor backend assembly or microelectronics packaging
- Direct hands-on experience with chip-scale packaging technologies including flip chip, wafer-level CSP, or advanced packaging processes
- Demonstrated expertise in 8D methodology, root cause analysis (5-Why, fishbone, fault tree), and structured problem-solving
- Working knowledge of AIAG Core Tools: PFMEA, Control Plans, MSA, PPAP, and APQP
- Master's degree in Materials Science, Engineering, or related technical field
- Six Sigma Green Belt or Black Belt certification
- Certified Quality Engineer (CQE) or Certified Quality Auditor (CQA) from ASQ
- ISO 9001 or IATF 16949 Lead Auditor certification
- Experience with wafer fabrication processes (etch, PVD, lithography, thin films) to support packaging integration
- Direct experience with flip chip bumping, redistribution layer (RDL) processes, or advanced wafer-level packaging
- Supplier quality experience with OSATs (Outsourced Semiconductor Assembly and Test) or foundries
- Familiarity with automotive (IATF 16949), aerospace (AS9100), or medical device (ISO 13485) quality standards
- Experience with reliability testing including temperature cycling, HAST, HTOL, and failure analysis techniques
- Knowledge of semiconductor metrology and characterization techniques (SEM, X-ray, C-SAM, profilometry)
- Advanced DOE expertise including fractional factorial, response surface methodology, and Taguchi methods
Skills
- Experience with ISO 9001 or equivalent quality management systems
- Proficiency with statistical analysis software (Minitab, JMP, or equivalent) and Microsoft Office suite
- Excellent written and verbal communication skills with ability to influence across organizational levels
Compensation
- A reasonable estimate of the pay range for this position is $ 75,000 to $115,000 USD.
Company info
- Semtech Corporation (NASDAQ:SMTC; www.semtech.com) is a leading supplier of high-quality semiconductor products.
- Semtech's Analog Mixed Signal and Wireless (AMW) Business Unit develops a broad portfolio of high-performance semiconductor solutions that power, protect, and connect modern electronics.
- The group's products span circuit protection devices that shield sensitive systems from voltage spikes and electrical overstress, RF solutions serving industrial, medical, and communications applications, advanced power management ICs including switching regulators and wireless charging solutions, and specialized sensing technologies.
- AMW's innovations are embedded across some of the fastest-growing markets today - from mobile and consumer devices to industrial automation, medical equipment, and connected infrastructure - making it a critical driver of Semtech's mission to make the world safer, more productive, and more sustainable.
- The Quality team at our Colorado Springs backend assembly site manages ISO 9001 certification and IATF 16949 transition, supporting chip-scale packaging operations including flip chip, wafer-level CSP, die attach, molding, and plating processes.
- We handle internal and external audits, process characterization, document control, and calibration - supporting two manufacturing sites and more than 1,000 controlled documents.
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