Intel
Packaging Module Development Engineer
US, Arizona, Phoenix
Sponsorship not specified$85k-$163kDetected 1 day ago
Data AnalysisProcurementCustomer SupportMechanical DesignElectrical Engineering
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odds of building a lasting career here
52Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role70
Entry-level history0
PERM / green-card track0
Lottery odds (Level III)83
Fits your clock70
Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.
Lottery odds assume a STEM candidate.
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About the role
- This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape.
- You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability.
Responsibilities
- Design and develop assembly processes and equipment to enable future packaging technologies.
- Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
- Oversee the manufacturability of package designs and manage their manufacturing cycles.
- Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
- Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
- Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
- Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.
Requirements
- Experience listed above should be a combination of the following:
- Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.
- Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
- You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position.
- Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.
Nice to have
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
- We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel.
- Shift 1 (United States of America)
- US, Arizona, Phoenix
- Posting Statement:
- Position of Trust
- Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Compensation
- Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
- The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Annual Salary Range for jobs which could be performed in the US:
- $85,200.00-162,500.00 USD
Benefits
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel.
- Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Company info
- We offer a total compensation package that ranks among the best in the industry.
This listing is sourced directly from Intel's careers page and normalized into a canonical job model.