Intel

Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Sponsorship not specified$85k-$163kDetected 1 day ago
Data AnalysisProcurementCustomer SupportMechanical DesignElectrical Engineering

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odds of building a lasting career here

52Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role70
Entry-level history0
PERM / green-card track0
Lottery odds (Level III)83
Fits your clock70

Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.

Lottery odds assume a STEM candidate.

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About the role

  • This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape.
  • You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability.

Responsibilities

  • Design and develop assembly processes and equipment to enable future packaging technologies.
  • Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
  • Oversee the manufacturability of package designs and manage their manufacturing cycles.
  • Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
  • Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
  • Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
  • Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.

Requirements

  • Experience listed above should be a combination of the following:
  • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.
  • Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
  • You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position.
  • Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.

Nice to have

  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
  • We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel.
  • Shift 1 (United States of America)
  • US, Arizona, Phoenix
  • Posting Statement:
  • Position of Trust
  • Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Compensation

  • Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
  • The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
  • Annual Salary Range for jobs which could be performed in the US:
  • $85,200.00-162,500.00 USD

Benefits

  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
  • Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Company info

  • We offer a total compensation package that ranks among the best in the industry.

This listing is sourced directly from Intel's careers page and normalized into a canonical job model.