Absolicsinc
Dielectric and Polymer Materials Engineer
Covington, Georgia · Full-time
Sponsorship not specified$100k-$150kDetected 20 days ago
SEMIntellectual PropertyElectrical EngineeringResearch
About the role
- By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
- This role requires both materials science depth and process integration awareness.
Responsibilities
- Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
- Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
- Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
- Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials
- You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization.
- In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly.
- You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.
- Life, STD, LTD 100 % support
Requirements
- Track record of material supplier engagement and collaborative efforts for material testing and qualification
- Required Skills:
Nice to have
- Fluent in English
- proficiency in Korean is a plus.
Skills
- Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
- Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
- Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
- Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
- Fluent in English; proficiency in Korean is a plus.
- Preferred Skills
- Direct experience with glass core or glass interposer dielectric process integration
- Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
- Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
- Experience with CMP of dielectric films in damascene or hybrid bonding contexts
- Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
- Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
Compensation
- $100,000 - $150,000
Benefits
- 401K 6% matching (NO vesting period)
- Healthcare 100% support (Health, Dental, Vision)
- PTO and self-development
Company info
- Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.
- We offer smart, innovative services to dozens of clients globally.
- Job Description:
- Requirements.
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