Intel

Intel

Module Engineering - Day Shift 5 or 7

US, Arizona, Phoenix · Junior · Internship

No sponsorship$85k-$163kDetected 8 days ago
Data AnalysisProcurementMechanical DesignElectrical EngineeringExperimental Design

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odds of building a lasting career here

59Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role100
Entry-level history0
PERM / green-card track0
Lottery odds (Level III)83
Fits your clock70

Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.

Lottery odds assume a STEM candidate.

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Employer immigration record

from this employer's Department of Labor filings

Green-card filing pattern in this occupation

Context, not a finding about this posting: of this employer's 333 green-card filings in this occupation, 100% were for a worker who already held the job.

Green-card follow-through: 74%

Of 318 labor certifications old enough to have been used, 83 expired without the employer filing the next step. Median time from filing to decision: 508 days.100% of their filings were for a worker who already held the job.Only certifications past the 180-day window are counted — recent ones cannot have expired yet.

Reported a layoff in this occupation

In a green-card filing decided 2026-05-14, this employer stated it had laid off workers in Software Developers (CA) during the preceding six months. 3 such filings on record.Describes the period before that filing, not necessarily today. Unlike WARN notices this is occupation-specific and federal.

Files H-1B transfers

33 transfer filings in the last year, covering 33 workers. Median labor-condition decision: 7 days. An employer that already files transfers is one that can take over an existing H-1B.

Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.

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About the role

  • Shift 5: (Day shift compressed work week) 6 AM-6 PM (Sunday-Tuesday and alternating Wednesdays).
  • Shift 7: (Day shift compressed work week) 6 AM-6 PM (Thursday-Saturday and alternating Wednesdays).
  • Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging.

Responsibilities

  • Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies.
  • Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs.
  • Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers.
  • Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing.
  • Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows.
  • Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment.
  • Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection, and process development based on a fundamental understanding of failure mechanisms.
  • Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance.
  • Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements.
  • Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones.

Requirements

  • US Citizenship required.
  • Bachelor's degree with 1+ years of experiencein one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
  • The Minimum qualifications are required to be initially considered for this position.
  • Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research.

Nice to have

  • Prior experience working in atechnology or semiconductor manufacturing environment.
  • Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.
  • Why Intel Foundry Technology Manufacturing?
  • This is your opportunity to grow your career while helping define the future of foundry manufacturing.
  • Experienced Hire
  • Shift 5 (United States of America)
  • US, Arizona, Phoenix
  • Posting Statement:

Compensation

  • Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
  • The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
  • Annual Salary Range for jobs which could be performed in the US:
  • $85,200.00-162,500.00 USD

Benefits

  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
  • Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Company info

  • Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers.
  • You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers.
  • We offer a total compensation package that ranks among the best in the industry.

Visa & Work Authorization

  • US Citizenship required
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This listing is sourced directly from Intel's careers page and normalized into a canonical job model.