PsiQuantum

PsiQuantum

Thermal Mechanical Engineer

Milpitas, California, United States · Full-time

Sponsorship not specified$100k-$145kDetected 134 days ago
AlgorithmsAccountingANSYSFEACFDEMI/EMCMechanical DesignElectrical EngineeringCOMSOL

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odds of building a lasting career here

53Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role74
Entry-level history0
PERM / green-card track0
Lottery odds (Level III)83
Fits your clock70

Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.

Lottery odds assume a STEM candidate.

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H-1B wage level

the lottery is wage-weighted — each level is one more entry

Level I · 1×
Level I$152,1731 entry
Level II$180,2942 entries
Level III$208,4373 entries
Level IV$236,5584 entries

The bottom of this range ($100,000) is below the Level I prevailing wage of $152,173. An H-1B cannot be filed below the prevailing wage, so an offer at the floor of this band could not be sponsored as posted.

DOL prevailing wage, 2026-27 wage year · Computer Hardware Engineers (17-2061) · San Jose-Sunnyvale-Santa Clara, CA. Wage level is derived by USCIS from the offered wage, occupation and worksite; the occupation shown is inferred from the job title.

Employer immigration record

from this employer's Department of Labor filings

Files H-1B transfers

4 transfer filings in the last year, covering 4 workers. Median labor-condition decision: 8 days. An employer that already files transfers is one that can take over an existing H-1B.

Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.

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About the role

  • The system engineering department is hiring a thermal mechanical engineer.
  • Your work will directly impact on the performance and reliability of our quantum computer sub-systems.

Responsibilities

  • Develop detailed FEA/CFD models of components, packages, optical-electronic modules, and system-level assemblies using appropriate simulation tools such as ANSYS, COMSOL, or equivalent platforms.
  • Correlate FEA results with experimental measurements, prototype test data, and hardware observations to improve model fidelity and support simulation-driven design decisions.
  • Perform warpage and deformation analysis for multi‑material assemblies, accounting for mismatch in thermal expansions, nonlinear material behavior, temperature gradients, and boundary conditions.
  • Develop thermal cycling and mechanical fatigue models to predict long‑term reliability, including creep, stress relaxation, and interface degradation.
  • Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield.
  • Analyze failures related to electro-optical assembly design and providing solutions. General design activities such as requirements management, materials and component selection, Design Failure Modes and Effects Analysis (FMEA), and tolerance analyses.
  • Develop end-to-end simulation workflows to automate processes, assess performance across diverse operating scenarios, documentation, and tools to improve efficiency, accuracy, and repeatability.
  • Document and communicate results through clear technical reports, design reviews, and executive level summaries.

Requirements

  • 5+years of hands-on modeling and simulation experience in the semiconductor industry.
  • Strong understanding of thermal conduction and convective heat transfer methodologies.
  • Deep knowledge of solid mechanics principles, including stress, strain, fatigue, creep, constitutive models of elastic, visco-plastic, and plastic materials.
  • Proficiency with simulation tools such as ANSYS (Mechanical, Icepak and Fluent), COMSOL, or equivalent, including nonlinear and transient analyses.
  • Working knowledge of lab-scale validation techniques.
  • M.Sc., or Ph.D in Mechanical Engineering, Electrical Engineering and Physics or related field.

Skills

  • Experience with Ansys AEDT and Ansys Sherlock.
  • Understanding advanced semiconductor packaging, solder joints, and reliability modeling techniques.
  • Knowledge of common optical system specifications and optical component specifications.
  • Exposure to SOC thermal mechanical analysis.
  • Exposure to optical structural analysis.

Compensation

  • $100,000 - $145,000 USD
  • Bay Area Pay Range
  • $140,000 - $160,000 USD

Company info

  • Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process.
  • We are not accepting unsolicited resumes from employment agencies.

Visa & Work Authorization

  • g pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domesti

This listing is sourced directly from PsiQuantum's careers page and normalized into a canonical job model.