Astera Labs Inc.
Technical Lead Package Platform Engineer
San Jose, California, United States · Senior
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odds of building a lasting career here
Sponsors, but it's cap-subject — you still face the weighted lottery (~61% per draw at Level IV). Good if you win; have a cap-exempt backup on your list.
Lottery odds assume a STEM candidate.
Personalize to your clock →H-1B wage level
the lottery is wage-weighted — each level is one more entry
$27,075 more — $187,075 — moves this role to Level II and 2 lottery entries. That figure is inside the range the employer already advertised.
Based on the DOL prevailing wage for this occupation and worksite, a base salary of $187,075 would place this position at wage Level II. That figure is within the posted range, and I'd like to target it. This role classifies under "Software Developers" for prevailing-wage purposes.
DOL prevailing wage, 2026-27 wage year · Software Developers (15-1252) · San Jose-Sunnyvale-Santa Clara, CA. Wage level is derived by USCIS from the offered wage, occupation and worksite; the occupation shown is inferred from the job title.
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Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.
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About the role
- We are seeking a L ead Package Engineer to drive the development, qualification, and manufacturing of advanced FCBGA packages.
- This role will drive package development from concept through NPI, qualification, and high-volume manufacturing, with strong ownership of technical execution, supplier management, project management, and package-related customer quality issues.
Responsibilities
- Lead FCBGA package NPI development from concept and die netlist through package design, assembly development, qualification, and production release.
- Manage technical execution with substrate suppliers and assembly OSAT partners, including schedule, quality, manufacturing readiness, yield improvement, and issue resolution.
- Lead technical project management activities, including project planning, milestone tracking, risk assessment and mitigation, issue escalation, and cross-functional execution.
- Collaborate with Package Design, Product Engineering, Program Management, Quality, Marketing, and other internal teams to ensure successful product development and launch.
- Lead package reliability assessment and qualification planning for FCBGA products, including large-body packages.
- Support system-level reliability assessment and risk mitigation for large-size FCBGA packages.
- Lead investigation and resolution of customer returns and field quality issues related to package assembly processes, materials, and workmanship quality.
- Drive root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention in collaboration with internal teams, material suppliers, substrate suppliers, and OSAT partners.
- Support package and substrate warpage characterization, analysis, and improvement, including the impact of materials, package architecture, and assembly processes.
- The successful candidate will work closely with package design, Product Engineering, Program Management, Quality, Marketing, substrate suppliers, and assembly OSAT partners to deliver robust, manufacturable, and reliable package solutions.
Requirements
- Bachelor's degree or higher in a related field
- Minimum of 5 years of professional experience in electronic packaging fields.
- Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies.
- Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release.
- Experience with package implementation from die netlist to flip-chip package design and manufacturing.
- Experience managing and resolving customer returns and field quality issues related to semiconductor packaging, particularly package assembly processes, material quality, and supplier workmanship.
- Strong problem-solving skills with experience in root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention.
Nice to have
- Experience with Cadence Allegro Package Designer (APD) or equivalent package design tools.
- Strong knowledge of FCBGA package reliability mechanisms, test methodologies, and qualification requirements.
- Experience with system-level reliability assessment of large-body FCBGA packages.
- Additional Assets
- Subject-matter expertise in Co-Packaged Optics (CPO) and/or Near-Packaged Optics (NPO).
- Deep technical expertise in package and substrate warpage, including characterization, modeling, material interactions, and assembly process impacts.
Compensation
- Base salary range is $160,000 to $200,000 depending on experience, level, and business need.
This listing is sourced directly from Astera Labs Inc.'s careers page and normalized into a canonical job model.