Etchedai
IC Package Engineer
Cupertino, CA
Sponsorship not specifiedDetected 118 days ago
NLPThermal AnalysisStructural AnalysisCadenceMechanical DesignElectrical EngineeringVoIPResearchCommunication
About the role
- You will play a key role in ensuring the mechanical and electrical integrity of packages that power the next generation of AI hardware.
- How we're different: Etched believes in the Bitter Lesson.
- We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Responsibilities
- Relocation support for those moving to Cupertino
Requirements
- The ideal candidate will have extensive experience with advanced packaging technologies such as CoWoS, large-scale BGA designs, and package warpage mitigation strategies.
- Expertise in large-scale BGA design, including experience with packages exceeding 4000-ball arrays, ball pitch optimization, routing, and power/ground plane design
- Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or related discipline
- 5+ years of experience in advanced IC package design, including CoWoS or equivalent technologies
- Strong understanding of stiffener design, open vs. closed package requirements, and package warpage and coplanarity challenges across various sizes
- Proficiency in package design tools such as Cadence APD/SIP, Mentor Xpedition, or similar
- Familiarity with mechanical stress analysis, simulation, and validation methodologies
- Experience with advanced packaging nodes (e.g., 2.5D/3D stacking)
Skills
- Etched believes in the Bitter Lesson.
Benefits
- Full medical, dental, and vision packages, with 100% of premium covered, 90% for dependents
Apply directly at Etchedai →Create a free account for alerts like thisView Etchedai immigration profile
This listing is sourced directly from Etchedai's careers page and normalized into a canonical job model.