Huawei Research Center Germany

Huawei Research Center Germany

Board-Level Reliability Research Engineer - Simulation and Testing Expert (m/f/d)

München, DE

Sponsorship not specifiedDetected 16 days ago
PythonComputer VisionElectrical EngineeringResearchCommunication

About the role

  • The role addresses challenges in material integration, thermo-mechanical response and system integration.
  • Expertise in multi-scale and multi-physics simulation, together with non-destructive testing technologies, will be the key assets for driving these projects.

Responsibilities

  • Perform PCBA mechanical stress simulation of large-size chips and participate in test verification research.
  • Collaborate in the research and development of new technologies that reduce PCBA stress reliability risk during product testing and assembly.
  • Reliability analysis and testing: Provide insights into non-destructive test technologies for simulation model validation and reliability design, including crack/delamination inside the package, the very thin bond line thickness between heatsink and chip, and in-situ stress/strain monitoring of the solder.
  • Develop and execute reliability test plans for board-level package integration, including thermal cycling, mechanical stress, humidity, and electrical performance evaluation.
  • Lead technology planning, advanced resource analysis, and cooperation with research and industry resources in Europe.
  • Establish and validate new simulation and test technologies to solve challenges raised by HQ, and work with HQ colleagues to apply these methods in real application scenarios.
  • Established relationships with research and industrial resources in Europe for simulation and testing, or willingness to build them.

Requirements

  • Fluent English required.
  • experience in stress simulation of PCBA and mechanical components/assemblies
  • experience with commercial finite element simulation tools
  • experience with non-destructive testing of failures/stress/strain or knowledge of the underlying physical principles.
  • At least one of the following: experience in stress simulation of PCBA and mechanical components/assemblies

Nice to have

  • Your areas of expertise M.S. or higher in Mechanical or Electrical Engineering (PhD preferred).
  • Experience in model order reduction, AI-assisted simulation and coding (Python, Fortran, etc.) is a plus.

This listing is sourced directly from Huawei Research Center Germany's careers page and normalized into a canonical job model.