meshopticaltechnologies
Senior Process Engineer
Gardena, CA · Senior
Sponsorship not specified$140k-$180kDetected 35 days ago
SEMProcess ImprovementElectrical EngineeringMentoring
About the role
- Our products require semiconductor-grade packaging processes-bumping, dicing, precision bonding, optical alignment, and automated assembly-executed at yield levels and volumes that demand real process engineering discipline.
Responsibilities
- Own development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materials
- Own tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume production
- Translate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturing
- Design production processes from the lab bench through proof of concept and production ramp
- Establish process limits and feedback process constraints as design rules to design teams
- Characterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teams
- Provide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the US
Requirements
- Extensive (MS + 2 years) hands-on semiconductor process-development experience
- Strong troubleshooting skills and hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
- Expertise in statistical quality control and process improvement methodologies, with experience leading internal audits and driving continuous improvement
- MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similar
- Demonstrated success qualifying processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
- Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
- Willingness to work extended hours and weekends as needed
Nice to have
- 5+ years of fab or wafer level packaging experience (e.g. lithography, etch, CVD, CMP, solder bumping, wafer dicing)
- Experience integrating photonic devices into complex opto-electronic packages, sub-µm die-bonding, wafer prep, and materials used in advanced packaging
Compensation
- Senior Process Engineer: $140,000.00 - $180,000.00/per year
- Title and base salary are determined on a case by case basis commensurate with experience and merit.
- In addition to base salary, compensation for this role includes:
- Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
- Relocation assistance to sunny Los Angeles.
Benefits
- Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
- Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
- Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
- 401(k) retirement plan access.
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