Renesaselectronics
Staff Package Development Engineer
Austin, TEXAS, United States · Staff+
Sponsorship not specifiedDetected 1 day ago
StatisticsProject ManagementMechanical DesignElectrical EngineeringVoIPResearchLeadershipCommunicationCollaborationProblem Solving
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odds of building a lasting career here
16Unrated
Cap-exempt (no lottery)0
Sponsors this role0
Entry-level history0
PERM / green-card track0
Lottery odds40
Fits your clock70
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About the role
- More information will be provided during the hiring process.
- Are you ready to join our team and shape the future with us?
- For more information, please read our Diversity & Inclusion Statement.
Requirements
- Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
- Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
- Strong knowledge of semiconductor assembly processes, including,
- Experience conducting package reliability testing, failure analysis, and root-cause investigations.
- Ability to work independently and effectively within cross-functional global teams.
Nice to have
- Master's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.
- Experience with advanced packaging technologies such as:
- Flip-Chip CSP (FCCSP)
- System-in-Package (SiP)
- Fan-Out Packaging (FOPLP/FOWLP)
- Wafer-Level Packaging (WLP/WLCSP)
- 2.5D/3D Packaging
- Knowledge of package thermal, mechanical, and electrical characterization techniques.
Company info
- At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial.
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This listing is sourced directly from Renesaselectronics's careers page and normalized into a canonical job model.