Intel

Intel

Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans

US, Oregon, Hillsboro · Mid · Internship

Sponsorship not specified$134k-$189kDetected 4 days ago
PythonMATLABMachine LearningData ScienceStatisticsSEMIntellectual PropertyCFDMechanical DesignResearchLeadershipCollaborationProblem SolvingMentoringPublic Speaking

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odds of building a lasting career here

64Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role100
Entry-level history0
PERM / green-card track0
Lottery odds (Level IV)94
Fits your clock70

Sponsors, but it's cap-subject — you still face the weighted lottery (~61% per draw at Level IV). Good if you win; have a cap-exempt backup on your list.

Lottery odds assume a STEM candidate.

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Employer immigration record

from this employer's Department of Labor filings

Green-card filing pattern in this occupation

Context, not a finding about this posting: of this employer's 333 green-card filings in this occupation, 100% were for a worker who already held the job.

Green-card follow-through: 74%

Of 318 labor certifications old enough to have been used, 83 expired without the employer filing the next step. Median time from filing to decision: 508 days.100% of their filings were for a worker who already held the job.Only certifications past the 180-day window are counted — recent ones cannot have expired yet.

Reported a layoff in this occupation

In a green-card filing decided 2026-05-14, this employer stated it had laid off workers in Software Developers (CA) during the preceding six months. 3 such filings on record.Describes the period before that filing, not necessarily today. Unlike WARN notices this is occupation-specific and federal.

Files H-1B transfers

33 transfer filings in the last year, covering 33 workers. Median labor-condition decision: 7 days. An employer that already files transfers is one that can take over an existing H-1B.

Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.

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About the role

  • Shape the Atomic Frontier of Semiconductor Innovation
  • At Intel Foundry Technology and Development (TD), we don't just participate in technology development
  • we engineer physical reality at the angstrom scale.

Responsibilities

  • Pioneer Next-Gen Process Architectures: Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world-class transistor architectures (RibbonFET/GAA), backside power delivery networks (PowerVia), and high-density interconnect scaling
  • Lead Hardware and Module Co-Optimization: Collaborate with premier global semiconductor equipment suppliers and specialty chemical vendors to push single-wafer and batch wet processing capabilities beyond conventional fluid-dynamic and surface-tension limits, co-engineering custom dispense, megasonic, and chamber hardware solutions
  • Drive High-Impact IP: Translate complex chemical, electrochemical, and surface phenomena into high-value patents, trade secrets, and proprietary wet processing solutions that sustain Intel Foundry's technological leadership
  • Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world-class transistor architectures (RibbonFET/GAA), backside power delivery networks (PowerVia), and high-density interconnect scaling
  • Lead Hardware and Module Co-Optimization:
  • Collaborate with premier global semiconductor equipment suppliers and specialty chemical vendors to push single-wafer and batch wet processing capabilities beyond conventional fluid-dynamic and surface-tension limits, co-engineering custom dispense, megasonic, and chamber hardware solutions
  • Drive High-Impact IP:

Requirements

  • are required to be initially considered for this position.

Nice to have

  • Hands-on experience with advanced thin-film, surface, and chemical characterization techniques (e.g., Ellipsometry, AFM, SEM/TEM, XPS, contact angle goniometry, FTIR, TXRF, or ICP-MS)
  • Experience with automated fluidic systems, wet processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics/mass-transfer troubleshooting
  • Strong publication record, conference presentations, or filed patent applications demonstrating systematic problem-solving in experimental chemical and materials science
  • For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
  • Shift 1 (United States of America)
  • US, Oregon, Hillsboro
  • Posting Statement:
  • Position of Trust

Compensation

  • packages, sign-on bonuses, annual performance bonuses, Employee Stock Purchase Plan (ESPP), equity/RSU grants, and full relocation assistance
  • Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
  • The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
  • Annual Salary Range for jobs which could be performed in the US:
  • $133,800.00-188,890.00 USD

Benefits

  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
  • Top-tier Ph.D. compensation packages, sign-on bonuses, annual performance bonuses, Employee Stock Purchase Plan (ESPP), equity/RSU grants, and full relocation assistance
  • Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
  • Comprehensive Total Rewards:
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Company info

  • At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom scale.
  • We are seeking visionary, research-driven Ph.D. graduates in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, and Engineering to spearhead the next breakthrough in semiconductor manufacturing.
  • As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering.
  • You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing.
  • We offer a total compensation package that ranks among the best in the industry.

Visa & Work Authorization

  • For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
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This listing is sourced directly from Intel's careers page and normalized into a canonical job model.