HP Inc.
SAW Process Engineer – MEMS & Microfluidics Manufacturing
Corvallis, Oregon, United States of America · Full-time
Sponsorship not specifiedDetected 62 days ago
Process ImprovementMechanical DesignCommunicationCollaboration
About the role
- The position requires strong expertise in mechanical process engineering, brittle material handling, and manufacturing process control, with direct accountability for process stability, defect reduction, and continuous improvement.
- Complexity • Responds to moderately complex issues within established guidelines.
- Disclaimer • This job description describes the general nature and level of work performed in this role.
Responsibilities
- Own and sustain wafer singulation (SAW/dicing) processes used in MEMS and microfluidics manufacturing, including silicon and multi‑layer substrate cutting.
- Develop, qualify, and maintain process recipes and cutting strategies, including blade selection, cut parameters, and mechanical process windows.
- Provide manufacturing process engineering support for production operations, including rapid response to yield excursions and defect trends related to singulation.
- Lead root cause analysis for mechanical defects such as chipping, cracking, edge damage, delamination, or die breakage, and implement corrective actions.
- Define and maintain process controls, critical parameters, and monitoring strategies to ensure consistent performance and robust manufacturing output.
- Lead material, tool, and process change qualifications through formal change management and validation practices.
- Support new product introduction (NPI) activities requiring new or modified singulation approaches.
- Collaborate cross‑functionally with operations, quality, reliability, and product engineering teams to ensure alignment on manufacturability and risk mitigation.
- Create and maintain process documentation, technical specifications, and standard work to support long‑term process sustainability.
- Own production wafer and panel mounting processes, including tools, performance, and continuous improvement.
Requirements
- 3-5 years of process engineering experience in semiconductor, MEMS, or microfluidics manufacturing.
- Demonstrated hands‑on experience with wafer dicing / singulation (SAW) processes, including precision mechanical cutting of brittle materials.
- Experience supporting high‑volume manufacturing environments with strong focus on yield, quality, and process stability.
Nice to have
- Experience with silicon wafer singulation, thin wafers, and multi‑layer or bonded substrate stacks.
- Understanding of mechanical stress, fracture mechanics, and damage modes associated with material removal processes.
- Experience implementing process controls, SPC, and structured problem‑solving methodologies.
- Familiarity with operating in cleanroom and semiconductor fabrication environments.
- Strong technical communication skills and ability to work across cross‑functional engineering and operations teams.
- Key Competencies
- Wafer dicing and singulation process engineering
- Mechanical process optimization
Visa & Work Authorization
- ty to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status,
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