Hyperlight
Failure Analysis Engineer
Cambridge, Massachusetts, United States · Mid
Stay score
odds of building a lasting career here
Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.
Lottery odds assume a STEM candidate.
Personalize to your clock →H-1B wage level
the lottery is wage-weighted — each level is one more entry
$14,042 more — $104,042 — moves this role to Level II and 2 lottery entries. That figure is inside the range the employer already advertised.
Based on the DOL prevailing wage for this occupation and worksite, a base salary of $104,042 would place this position at wage Level II. That figure is within the posted range, and I'd like to target it. This role classifies under "Mechanical Engineers" for prevailing-wage purposes.
DOL prevailing wage, 2026-27 wage year · Mechanical Engineers (17-2141) · Boston-Cambridge-Newton, MA-NH. Wage level is derived by USCIS from the offered wage, occupation and worksite; the occupation shown is inferred from the job title.
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About the role
- It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready.
- We assembled a world class team covering engineering, business, and operations.
- We believe in the power of integrity, innovation, collaboration, and pragmatic solutions.
Responsibilities
- Own FA cases end to end: define the question, plan the analysis, execute it, and write it up.
- Perform surface and chemical characterization - XPS, Raman, FTIR - and interpret the data, not just acquire it.
- Specify and manage outsourced analysis (e.g. TEM) with external labs.
- Support post-reliability FA on stressed parts (HAST, damp heat, thermal cycling) and on customer returns, working with the Test and Reliability engineers.
- Maintain sample chain of custody, case records, and the FA findings database.
- Demonstrated ability to design an analysis with appropriate controls, identify confounding variables, and keep observation separate from inference.
- At the core of our work is the TFLN Chiplet™ platform - a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems.
- We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.
- FA lead and will grow into owning cases independently across the full workflow:
- Own FA cases end to end:
Requirements
- non-destructive before destructive and know when a cross-section is worth spending the only sample you have.
- You have been qualified on and worked unsupervised with at least three of: photolithography and resist processing, plasma/RIE etch, wet etch, thin-film deposition (PVD/CVD/ALD), e-beam lithography.
- You can produce a report that a non-specialist stakeholder can act on.
Nice to have
- Independent SEM operation, including imaging of insulating and PIC samples, plus EDS acquisition and interpretation.
- Preferred FIB for cross-sectioning, lift-out, and TEM lamella preparation.
Compensation
- $90k-$180k
Company info
- Founded in 2018 and backed by leading venture capital, we've built a team and a platform focused on real-world mass deployment of TFLN photonics technology.
This listing is sourced directly from Hyperlight's careers page and normalized into a canonical job model.