Intel

Intel

Module Engineer On Shift (MEOS)

US, Arizona, Phoenix · Mid · Internship

Sponsorship not specified$85k-$163kDetected 5 days ago
PythonData AnalysisData ScienceStatisticsProcurementMechanical DesignElectrical EngineeringResearchCommunicationProblem SolvingAdaptability

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odds of building a lasting career here

59Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role100
Entry-level history0
PERM / green-card track0
Lottery odds (Level III)83
Fits your clock70

Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.

Lottery odds assume a STEM candidate.

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Employer immigration record

from this employer's Department of Labor filings

Green-card filing pattern in this occupation

Context, not a finding about this posting: of this employer's 333 green-card filings in this occupation, 100% were for a worker who already held the job.

Green-card follow-through: 74%

Of 318 labor certifications old enough to have been used, 83 expired without the employer filing the next step. Median time from filing to decision: 508 days.100% of their filings were for a worker who already held the job.Only certifications past the 180-day window are counted — recent ones cannot have expired yet.

Reported a layoff in this occupation

In a green-card filing decided 2026-05-14, this employer stated it had laid off workers in Software Developers (CA) during the preceding six months. 3 such filings on record.Describes the period before that filing, not necessarily today. Unlike WARN notices this is occupation-specific and federal.

Files H-1B transfers

33 transfer filings in the last year, covering 33 workers. Median labor-condition decision: 7 days. An employer that already files transfers is one that can take over an existing H-1B.

Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.

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About the role

  • Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence.
  • Are you passionate about semiconductor innovation and ready to make a real impact from day one?
  • Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts.

Responsibilities

  • Design and develop assembly packaging processes and equipment to enable next-generation semiconductor technologies.
  • Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to create and refine process and equipment specifications.
  • Oversee the manufacturability of package designs and manage the full lifecycle of packaging processes, procedures, and workflows.
  • Collaborate with suppliers and procurement teams to establish material specifications and ensure compliance with quality and performance standards.
  • Develop innovative techniques, tools, and quality screens to identify packaging quality and reliability issues early in the development cycle.
  • Set reliability standards based on a deep understanding of failure mechanisms, influencing design, material selection, and process development.
  • Provide technical consultation and support for packaging process improvements while responding to internal customer and client needs.
  • Drive standardization in product qualification, manufacturing quality systems, and engineering practices, ensuring alignment with key product milestones.
  • Collaborative Spirit - You thrive in cross-functional team environments and build strong working relationships with colleagues, suppliers, and stakeholders.
  • Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.

Requirements

  • Bachelor's degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology or a related field with 2+ years of hands-on experience in any of the following
  • You must possess the below minimum qualifications to be initially considered for this position.
  • Curiosity & Eagerness to Learn - You have a growth mindset and are always looking to deepen your knowledge and skills.
  • Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

Nice to have

  • This Position is not eligible for Intel immigration sponsorship.
  • 2+ years of experience in:
  • Laser, optical systems, or semiconductor assembly processes.
  • In a technology manufacturing or semiconductor packaging environment.
  • Equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly settings.
  • Data science and statistics tools such as Python, JMP, or Minitab for data analysis and visualization
  • Experienced Hire
  • Shift 4 (United States of America)

Skills

  • Shift Information

Compensation

  • Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
  • The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
  • Annual Salary Range for jobs which could be performed in the US:
  • $85,200.00-162,500.00 USD

Benefits

  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
  • Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Company info

  • We offer a total compensation package that ranks among the best in the industry.

Visa & Work Authorization

  • This Position is not eligible for Intel immigration sponsorship.
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This listing is sourced directly from Intel's careers page and normalized into a canonical job model.