Absolicsinc

Absolicsinc

Process Integration Engineer

Covington, Georgia · Full-time

Sponsorship not specified$100k-$150kDetected 20 days ago
SEMSAPProcess ImprovementIntellectual PropertyElectrical EngineeringLeadershipCollaborationPublic Speaking

About the role

  • By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Responsibilities

  • Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.
  • Develop and implement process integration strategies to optimize production yield and efficiency.
  • Maintain detailed documentation of processes and procedures.
  • Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up
  • Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation
  • wet + dry clean/etch/develop processes
  • Life, STD, LTD 100 % support

Requirements

  • Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel-level CMP, advanced laser/plasma drill, novel dielectric chemistries)
  • Required Skills:

Nice to have

  • Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch)
  • Strong cross-functional collaboration skills
  • ability to translate unit-process engineer findings into integration-level decisions and vice versa
  • Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test)
  • Fluent in English
  • proficiency in Korean is a plus.
  • Familiarity with bifurcated roadmap considerations (high-performance AI/HPC vs. cost-optimized mainstream paths) and how that shapes architecture and material tradeoffs

Skills

  • Statistical process control and DOE methodology for multi-variable, multi-step process optimization
  • Fluent in English; proficiency in Korean is a plus.
  • Preferred Skills
  • Experience with glass core substrates
  • Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges
  • Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices
  • Experience presenting integration roadmaps or technical reviews to leadership or cross-functional stakeholders
  • Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration
  • Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred

Compensation

  • $100,000 - $150,000

Benefits

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • PTO and self-development

Company info

  • Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.
  • We offer smart, innovative services to dozens of clients globally.
  • Job Description:
  • We are seeking a highly skilled and experienced Process Integration Engineer to join our team.
  • The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:
  • dielectric materials selection and application
  • lithography
  • PVD and electroplating
  • into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures.
  • You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow.
  • You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility.
  • In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.
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