Nvidia ITE
Senior IC Packaging Development Engineer
US, CA, Santa Clara · Senior
Sponsorship not specifiedDetected 6 days ago
SEMANSYSFEACadenceMechanical DesignElectrical EngineeringCollaboration
About the role
- If you're creative and autonomous with a real passion for your work, we want to hear from you!
- Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.
Responsibilities
- Drive the process, mechanical, thermal, and material evaluation of the latest IC packages.
- Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.
- 12 + years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).
Requirements
- Prior knowledge of Package related Failure Analysis is beneficial.
- Collaborate with foundries and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.
Compensation
- Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.
- The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6.
Benefits
- You will also be eligible for equity and benefits.
Equal opportunity
- equal opportunity employer.
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This listing is sourced directly from Nvidia ITE's careers page and normalized into a canonical job model.