GlobalFoundries

GlobalFoundries

Packaging Integration Engineer (2026 New College Graduate)

Essex Junction, USA

Sponsorship not specified$50k-$88kDetected 15 days ago
Communication

About the role

  • Expected Salary Range $50,400.00 - $88,200.00 The exact Salary will be determined based on qualifications, experience and location.

Responsibilities

  • Support new customer products with innovative design solutions and technology design rules.
  • Drive design reviews with cross functional teams
  • Drive cross functional teams to resolve technical & yield concerns
  • Develop engineering team skills in packaging design constraints and considerations
  • Develop complex analysis models to predict manufacturability, cost, and quality.
  • Foster discipline and qualification robustness through a consistent global design process
  • Drive CIP (Continuous improvement plans) to deliver organizational goals.
  • GlobalFoundries (GF) seeks a hands-on Assembly Integration Design Engineer that will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors.
  • The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design, with a focus on product and module performance, reliability, packaging design rules, materials selection criteria, and definition of electrical, photonic and thermal requirements for chiplet and product modules.

Requirements

  • Bachelors or Masters degree
  • Experience in bringing packaged products from development into production.
  • Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.

Nice to have

  • Materials science, thermal, mechanical, simulation background.
  • Experience with failure analysis, design of experiments, & packaging process integration.
  • Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
  • Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
  • $50,400.00 - $88,200.00
  • Requests for accommodation will be considered on a case-by-case basis.
  • Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
  • An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

Skills

  • For more information, visit www.gf.com.

Compensation

  • Expected Salary Range

Benefits

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Company info

  • Drive SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
  • Protect the business by ensuring that all necessary requirements are met and that the technology meets the expectations of customers and markets to avoid costly re-designs.

This listing is sourced directly from GlobalFoundries's careers page and normalized into a canonical job model.