Boston Materials

Senior Applications Engineer, Thermal Interface Material Integration

Billerica, MA · Senior · Full-time

Work authorization required$120k-$180kDetected 188 days ago

Data AnalysisBusiness DevelopmentFEAThermal AnalysisMechanical DesignElectrical EngineeringCommunicationProblem Solving

About the role

This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation.
This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.
Join us to solve one of the most critical challenges facing the Semiconductor and Electronics Industry - thermal management!

Lead internal design and development efforts to integrate our liquid-metal based thermal interface materials into customer-specific electronic packages.
Build and test package and provision assembly mockups to demonstrate design feasibility, which may include mechanical and reliability testing.
Document designs for both fabrication and customer coordination. Lead effort to fabricate provisions either internally or externally in support of customer schedules.
Support R&D team in continuous improvement of system performance.
Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams.

Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.
Applicants must be currently authorized to work in the US on a full-time basis.

Act as the primary technical point of contact for ODM, OSAT, and hyperscaler customer technical teams during early and mid-stage engagement.
Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.
Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation.
3-7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company.
Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.).

We are seeking a highly motivated Senior Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products.

This listing is sourced directly from Boston Materials's careers page and normalized into a canonical job model.