Lumilens

Senior/Principal Signal Integrity Engineer-Silicon Photonics & AI Interconnects

San Jose · Principal

Sponsorship not specifiedDetected 121 days ago

PythonMATLABCloud PlatformsData AnalysisANSYSEMI/EMCElectrical EngineeringSimulinkLeadershipCommunication

About the role

Lumilens is revolutionizing AI compute infrastructure with next-generation photonic interconnects.
Our solutions-leveraging co-packaged optics (CPO), near-packaged optics (NPO), high-density silicon photonics, and advanced heterogeneous integration-enable massive scale-out and scale-up architectures for the world's leading AI providers.

Perform detailed electromagnetic (EM) modeling, extraction, and simulation of advanced packages, including silicon interposers, bridges, 2.5D/3D stacks, fan-out, CoWoS-like, and EMIB-like structures.
Develop and optimize package stack-ups, routing strategies, via transitions, bump pitch/layout, and redistribution layers (RDL) to minimize insertion/return loss, crosstalk, mode conversion, and impedance discontinuities.
Collaborate closely with silicon, photonic IC, and system design teams on bump map/pinout optimization, die-to-package co-design, floorplanning, and meeting SI targets across CMOS, BiCMOS and photonic processes.
Establish SI design rules, guidelines, and best practices for advanced packaging in photonic-integrated systems, ensuring adoption across projects.
Partner with lab teams to correlate simulations with high-frequency measurements (VNA, TDR/TDT, oscilloscopes, BERTs) on test vehicles, including de-embedding of fixtures and launch structures.
Lead technical reviews, present SI/PI findings to cross-functional stakeholders (technical and non-technical), and drive timely closure of design issues.
Professional development opportunities and certification support

Deep expertise in very high-speed SerDes (≥56G, preferably 100G/200G PAM4), including channel modeling, equalization (FFE/DFE/CTLE), jitter/crosstalk analysis, eye diagrams, BER, and compliance/margining.
Extensive hands-on experience with leading SI/PI/EM tools (e.g., Ansys HFSS 3D/Layout, SIwave, Clarity, CST, Keysight ADS Momentum/Sigrity, HSPICE, HyperLynx).
Proven proficiency in time-domain transient simulations (HSPICE, ADS, MATLAB/Simulink) and scripting/automation (Python, TCL, MATLAB) for simulation flows, data analysis, and reporting.
Hands-on experience with 2.5D/3D packaging technologies (silicon/organic interposers, chiplet integration, HBM stacking) and high-frequency transmission line routing in silicon/photonic contexts.

Experience with power integrity co-simulation and SSO in advanced photonic-electronic packages.
Knowledge of emerging substrates (glass core, panel-level packaging) and optical interconnects (from pluggables to full CPO/NPO).
Background in EMI/EMC, mechanical, and thermal considerations for co-packaged optics and their SI/PI trade-offs.
Access to cutting-edge technology and cloud platforms
Collaborative work environment with cross-functional teams
Lumilens is an equal opportunity employer.
Bachelor's or Master's degree in Electrical Engineering, Physics, or related field (PhD preferred).

This isn't incremental innovation, it's a ground-floor opportunity to rethink the optical layer from the silicon up.

Comprehensive benefits package including health insurance
All qualified applicants will receive consideration without regard to race, color, religion, gender, identity, orientation, veteran status, disability, or any other legally protected status.

We are seeking a world-class Senior / Principal Signal Integrity Engineer to own and drive signal integrity (SI) and closely related power delivery strategies across complex 2.5D/3D packages.

This listing is sourced directly from Lumilens's careers page and normalized into a canonical job model.