K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · Senior

Sponsorship not specified$180k-$260kDetected 20 days ago

Thermal AnalysisMechanical DesignElectrical Engineering

About the role

We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
This role supports the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
You will collaborate with internal teams for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.

Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
Establish package design standards, methodologies, and best practices.
Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy
Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
Drive material selection, substrate technology choices, and assembly process optimization.
Building a spacecraft unlike any other requires a team unlike any other and non-traditional career twists and turns are encouraged!

Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
Proven experience delivering high-pin-count, high-performance ASIC packages into production.
Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
Experience working directly with OSATs and substrate vendors.
Knowledge of packaging qualification and test methodologies.
If you are a motivated individual who thrives in a fast-paced environment and you're excited about contributing to the success of a groundbreaking Series C space startup, we'd love for you to apply.
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.

Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
Background in high-speed digital or mixed-signal SoCs.
Familiarity with aerospace, space, or high-reliability electronics.
If you don't meet 100% of the preferred skills and experience, we encourage you to still apply!
Export Compliance
As defined in the ITAR, "U.S. Persons" include U.S. citizens, lawful permanent residents (i.e., Green Card holders), and certain

Base salary range for this role is $180,000 - $260,000 + equity in the company
Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks

If you need a reasonable accommodation as part of your application for employment or interviews with us, please let us know.

This listing is sourced directly from K2 Space's careers page and normalized into a canonical job model.