Lumilens

Advanced Package Technology Principal Engineer

San Jose · Principal

Sponsorship not specifiedDetected 121 days ago

ANSYSFEAMechanical Design5G/LTECommunicationCollaboration

About the role

At Lumilens, we are redefining the optical layer that powers tomorrow's AI and high‑performance computing.

Perform FEA simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across advanced package architectures (flip‑chip, fan‑out, 2.5D/3D IC, chiplet‑based, TSVs).
Define simulation requirements, analyse results, and deliver actionable design and process recommendations.
Support technology road mapping by assessing new materials, interconnect structures, and process flows from a thermo‑mechanical reliability perspective.
Lead DOE studies and sensitivity analyses to identify key reliability and performance drivers.
Collaborate with cross‑functional teams (design, photonics, manufacturing, reliability, vendors) to ensure robust, scalable package architectures.
you will partner closely with R&D, manufacturing, and reliability teams to influence ASIC mechanical design from the earliest stages.
You will design, model, and optimize advanced multi‑chip‑module (MCM) architectures and mainstream flip‑chip BGA (FCBGA) packages to support Lumilens' high‑speed photonic engines.

Bachelor's in Mechanical Engineering (or related field) with 12+ years FEA experience, Master's with 10+, or PhD with 7+.
Deep expertise in advanced packaging technologies, including flip‑chip, FOWLP, 2.5D/3D integration, chiplet architectures, and TSVs.
Strong understanding of materials behavior across polymers, metals, ceramics, and their thermo‑mechanical interactions.
Familiarity with semiconductor packaging processes such as die attach, underfill, molding, bumping, and reflow.
Proficiency with FEA tools, including Ansys Classic/Mechanical and Abaqus.
Ability to interpret and correlate complex simulation results using first‑principles mechanical engineering concepts.
Excellent self‑management, organizational discipline, and ability to thrive in a fast‑moving environment.

This isn't incremental innovation, it's a ground-floor opportunity to rethink the optical layer from the silicon up.

We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation of high‑performance packaging solutions for advanced ASICs.

This listing is sourced directly from Lumilens's careers page and normalized into a canonical job model.