Intel
Ocotillo Technology Fabrication Lithography Module Engineer - Layer Owner
US, Arizona, Phoenix · Internship
Sponsorship not specified$89k-$171kDetected 11 hours ago
PythonData AnalysisStatisticsElectrical EngineeringControlsExperimental DesignLeadershipProblem Solving
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52Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role70
Entry-level history0
PERM / green-card track0
Lottery odds (Level III)83
Fits your clock70
Sponsors, but it's cap-subject — you still face the weighted lottery (~45% per draw at Level III). Good if you win; have a cap-exempt backup on your list.
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About the role
- Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent.
- The Ocotillo Technology Fabrication (OTF) Lithography Module Engineer - Layer Owner role is multifaceted.
- As an OTF Lithography Layer Owner you will play an important role in the OTF engineering team.
Responsibilities
- Drives improvements on quality, yield, reliability, process stability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.
- Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future.
- Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.
- Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs.
- Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements.
- Join Intel and build a better tomorrow.
- Join and help us create the next generation of technologies that will shape the future for decades to come.
- The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module.
Requirements
- Bachelor's degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field with 4+ years of experience, OR
- Master's degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field with 2+ years of experience, OR
- PhD degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field.
- Semiconductor Engineering experience.
- Experience supporting high-volume manufacturing ramps and technology transfers.
- Semiconductor process engineering experience in high-volume manufacturing, process development, or technology transfer.
- Experience with lithography, patterning, process control, or yield improvement.
- Experience troubleshooting manufacturing issues using statistical analysis and data-driven problem solving.
- You must possess the below minimum qualifications to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
- Working in a high performing team culture which includes setting high expectations.
- Driving accountability to those expectations with a high sense of urgency.
- Role modeling the desired culture. Possess teamwork and leadership skills.
- Problem solving and prioritization skills.
- Driving high performance maintenance goals for the group.
- Use data to influence factory and virtual factory direction.
- Listening, written and verbal communication.
- Deal with ambiguity in defining activities and direction.
Nice to have
- Experience working in a semiconductor factory as a technician or engineer prior to Engineering role.
- and the skills to apply that knowledge to tool matching, tool qualification, and process development.
- Technical and troubleshooting experience.
- Direct experience in Lithography as a Process Engineer, Module Engineer, or Layer Owner.
- Experience with EUV or immersion lithography, overlay, critical dimension (CD) control, and defect reduction.
- Experience with DOE, SPC, tool qualification, tool matching, and process characterization.
- Proficiency with JMP, Python, or similar data analysis tools.
- Experience supporting technology development, factory startup, or high-volume manufacturing ramps.
Compensation
- Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD
- The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Annual Salary Range for jobs which could be performed in the US:
- $89,010.00-170,630.00 USD
Benefits
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel.
- Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Company info
- We offer a total compensation package that ranks among the best in the industry.
This listing is sourced directly from Intel's careers page and normalized into a canonical job model.