TRUMPF Graduates and Professionals

Packaging Engineer

Cranbury, NJ

Sponsorship not specified$93k-$113kDetected 30 days ago

AccessibilityProcess ImprovementElectrical EngineeringCollaborationProblem Solving

About the role

Join a team pushing the limits of laser technology.
You'll be the go-to expert for key production tools and processes, championing uptime, stability, and continuous improvement while partnering closely with R&D to bring new concepts to life on the factory floor.
Pay Range: $93,253.50 - $112,504 TRUMPF Inc. endeavors to make TRUMPF careers pages accessible to any and all users.

Own and optimize die bonding and wire bonding processes and tools for high‑power diode lasers.
Lead interface characterization and packaging process tuning based on optical KPIs (power, voltage, slow axis, smile, placement accuracy, etc.).
Drive yield improvement and cost reduction initiatives
spot yield excursions fast and implement robust corrective actions.
Lead and contribute to 4D/8D problem-solving and shepherd ECNs, including MES/Database updates.
Partner with R&D to industrialize new processes
Use SPC, MSA, DOE, and JMP/Minitab to deliver data‑driven process improvements.
deliver high‑quality results on time.
Drive yield improvement and cost reduction initiatives; spot yield excursions fast and implement robust corrective actions.
Partner with R&D to industrialize new processes; define qualification plans and specifications for new equipment and methods.

Manufacturing support experience in lasers or semiconductors (preferred).
Excellent communicator who gives and receives feedback constructively.
Why this role
Impact: Your processes directly shape performance in advanced laser products.
Variety: From sustaining and yield to ECNs and new‑process quals-no two days are the same.
Growth: Work at the intersection of production and R&D with room to lead.

define qualification plans and specifications for new equipment and methods.
Tackle complex equipment and process issues with structured troubleshooting
Communicate clearly, influence cross‑functional teams, and mentor peers while executing well‑defined tasks with guidance as needed.
BS or MS in Mechanical/Electrical Engineering, Materials Science, or Physics.
3+ years hands‑on with die attach, thermocompression bonding, wire bonding, vacuum reflow, and pick‑and‑place.
Familiarity with K&S or F&K wire bonders, and/or SET die bonders (plus).
Strong with JMP, Minitab, or similar statistical tools
fluent in SPC/DOE/Six Sigma/problem solving (certification a plus).

This contact information is for accommodation requests only and can not be used to inquire about the status of application.

This listing is sourced directly from TRUMPF Graduates and Professionals's careers page and normalized into a canonical job model.