Intel
Module Engineering PhD Intern New 2027
US, Oregon, Hillsboro · Intern · Internship
Sponsorship not specifiedDetected 5 days ago
PythonMATLABData AnalysisStatisticsExcelProcess ImprovementMechanical DesignElectrical EngineeringResearchCommunicationCollaborationProblem Solving
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odds of building a lasting career here
42Risky
Cap-exempt (no lottery)0
Sponsors this role100
Entry-level history0
PERM / green-card track0
Lottery odds40
Fits your clock70
Thin sponsorship signal and lottery-bound. A low-probability bet with your clock running. Prioritize cap-exempt roles and proven entry-level sponsors first.
Lottery odds assume a STEM candidate.
Personalize to your clock →Employer immigration record
from this employer's Department of Labor filings
Green-card filing pattern in this occupation
Context, not a finding about this posting: of this employer's 333 green-card filings in this occupation, 100% were for a worker who already held the job.
Green-card follow-through: 74%
Of 318 labor certifications old enough to have been used, 83 expired without the employer filing the next step. Median time from filing to decision: 508 days.100% of their filings were for a worker who already held the job.Only certifications past the 180-day window are counted — recent ones cannot have expired yet.
Reported a layoff in this occupation
In a green-card filing decided 2026-05-14, this employer stated it had laid off workers in Software Developers (CA) during the preceding six months. 3 such filings on record.Describes the period before that filing, not necessarily today. Unlike WARN notices this is occupation-specific and federal.
Files H-1B transfers
33 transfer filings in the last year, covering 33 workers. Median labor-condition decision: 7 days. An employer that already files transfers is one that can take over an existing H-1B.
Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.
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About the role
- This internship provides a unique opportunity to apply research and technical expertise to real-world engineering challenges.
- Intel Foundry is a leader in semiconductor manufacturing, delivering innovative process technologies that enable next-generation computing solutions.
Responsibilities
- Support the development, improvement, and implementation of semiconductor manufacturing processes within assigned modules.
- Support projects focused on yield improvement, quality enhancement, cost reduction, and operational efficiency.
- Collaborate with cross-functional teams to improve process control methodologies and manufacturing performance.
- Design and execute experiments to evaluate process modifications and drive continuous improvement initiatives.
- Document technical findings and communicate recommendations to engineering stakeholders.
- In this role, you will work alongside experienced engineers to improve manufacturing processes, optimize equipment performance, and drive operational excellence within a high-volume production environment.
Requirements
- Strong academic performance with a cumulative GPA of 3.0 or higher required
- Our standard internship rates are based on your degree, location, and the job role.
- Currently pursuing a PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Physics, Applied Chemistry, Computer Science or a related STEM discipline.
- Minimum of 3 months of research, laboratory, internship, academic, or industry experience.
Nice to have
- Experience with data analysis tools (JMP, Python, MATLAB, Excel).
- Knowledge of DOE, statistical analysis, and process optimization.
- Understanding of semiconductor manufacturing and process engineering fundamentals.
- Programming experience for engineering or scientific applications.
- Strong analytical, problem-solving, and data interpretation skills.
- Effective communication and teamwork skills.
- Ability to work independently in a collaborative environment.
- Willingness to work in a semiconductor manufacturing cleanroom.
Skills
- Join Intel as a Module Engineering PhD Intern and contribute to the development of advanced semiconductor manufacturing technologies.
Compensation
- Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD
- The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
- Annual Salary Range for jobs which could be performed in the US:
- $120,898.00-120,902.00 USD
Benefits
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel.
- Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.
Company info
- We offer a total compensation package that ranks among the best in the industry.
This listing is sourced directly from Intel's careers page and normalized into a canonical job model.