Lumilens
IC Package FEA Engineer
San Jose
Sponsorship not specifiedDetected 121 days ago
ANSYSFEAMechanical Design5G/LTECommunicationCollaboration
About the role
- At Lumilens, we are redefining the optical layer that powers tomorrow's AI and high‑performance computing.
Responsibilities
- Perform FEA simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across advanced package architectures (flip‑chip, fan‑out, 2.5D/3D IC, chiplet‑based, TSVs).
- Define simulation requirements, analyse results, and deliver actionable design and process recommendations.
- Support technology road mapping by assessing new materials, interconnect structures, and process flows from a thermo‑mechanical reliability perspective.
- Lead DOE studies and sensitivity analyses to identify key reliability and performance drivers.
- Collaborate with cross‑functional teams (design, photonics, manufacturing, reliability, vendors) to ensure robust, scalable package architectures.
- you will partner closely with R&D, manufacturing, and reliability teams to influence ASIC mechanical design from the earliest stages.
- You will design, model, and optimize advanced multi‑chip‑module (MCM) architectures and mainstream flip‑chip BGA (FCBGA) packages to support Lumilens' high‑speed photonic engines.
Requirements
- Bachelor's in Mechanical Engineering (or related field) with 12+ years FEA experience, Master's with 10+, or PhD with 7+.
- Deep expertise in advanced packaging technologies, including flip‑chip, FOWLP, 2.5D/3D integration, chiplet architectures, and TSVs.
- Strong understanding of materials behavior across polymers, metals, ceramics, and their thermo‑mechanical interactions.
- Familiarity with semiconductor packaging processes such as die attach, underfill, molding, bumping, and reflow.
- Proficiency with FEA tools, including Ansys Classic/Mechanical and Abaqus.
- Ability to interpret and correlate complex simulation results using first‑principles mechanical engineering concepts.
- Excellent self‑management, organizational discipline, and ability to thrive in a fast‑moving environment.
Skills
- This isn't incremental innovation, it's a ground-floor opportunity to rethink the optical layer from the silicon up.
Company info
- We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation of high‑performance packaging solutions for advanced ASICs.
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This listing is sourced directly from Lumilens's careers page and normalized into a canonical job model.