TTM Technologies

TTM Technologies

R&D Process Development Engineer

Eau Claire, WI

Sponsorship not specified$10k-$20kDetected 3 hours ago
SEMSAPERPPCB DesignCAMMechanical DesignElectrical EngineeringRF EngineeringMicroscopyMedical Devices

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odds of building a lasting career here

37Risky
Cap-exempt (no lottery)0
Sponsors this role80
Entry-level history0
PERM / green-card track0
Lottery odds (Level I)39
Fits your clock70

Thin sponsorship signal and lottery-bound (~15% per draw). A low-probability bet with your clock running. Prioritize cap-exempt roles and proven entry-level sponsors first.

Lottery odds assume a STEM candidate.

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About the role

  • Need for R&D engineering across four critical PCB fabrication disciplines:
  • Mechanical Processing, Lithography, Electroplating, and Etching.
  • This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing - requiring both deep scientific rigor and practical manufacturing instincts.

Responsibilities

  • Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D.
  • SAP: Fundamentals of SAP Build up or FOWLP technology including hands on experience.

Requirements

  • Required: Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
  • Required: 3-8 years of hands-on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
  • Required: Direct, hands-on experience with at least two of the four focus areas: Mechanical, Lithography, Electroplating, or Etching.
  • PPE Required: Chemical-resistant gloves, safety glasses/face shield, lab coat, acid-resistant apron, and additional PPE as required by SDS and EHS protocols.
  • Ability to stand for extended periods
  • As required by local law, TTM provides a reasonable range of compensation for roles that may be hired in New York, California and Colorado.

Nice to have

  • Master or PhD of Science in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing.
  • 3-8 years of hands-on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
  • Direct, hands-on experience with at least two of the four focus areas: Mechanical, Lithography, Electroplating, or Etching.
  • Experience in semiconductor fab or FOWLP,
  • Technical Knowledge
  • Primary Setting:
  • PCB manufacturing facility - process engineering laboratory and production floor.
  • Chemical Exposure:

Compensation

  • As required by local law, TTM provides a reasonable range of compensation for roles that may be hired in New York, California and Colorado.

Benefits

  • TTM offers a variety of health and well-being benefit programs.
  • Benefit options include medical, dental, vision, 401K, Flexible Spending Account, Health Savings Account, accident benefits, life insurance, disability benefits, paid vacation & holidays.
  • Benefits are available 1st of the month following date of hire.

Company info

  • We are committed to pushing the boundaries of PCB technology through disciplined process development, continuous improvement, and an unwavering dedication to quality and customer satisfaction.
  • Develop technology that can be scaled to provide solutions to customers across TTM's markets.

Equal opportunity

  • All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.

Visa & Work Authorization

  • Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and un
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This listing is sourced directly from TTM Technologies's careers page and normalized into a canonical job model.