Cariadinc

Cariadinc

Principal Engineer, SI-PI

Mountain View, CA · Principal

Sponsorship not specifiedDetected 70 days ago
PythonMATLABData AnalysisANSYSPCB DesignCadenceEMI/EMCLeadershipCommunicationCollaborationProblem Solving

About the role

  • Scope spans compute modules and carrier boards, high-speed connectors/cables, and return-path/grounding considerations from concept through EVT/DVT/PVT.
  • This role ensures clean high-speed signaling and robust power delivery across PCB, package, and system interconnects to prevent noise, jitter, data errors, EMI failures, and system instability.

Responsibilities

  • Own channel budgets and SI sign-off reports per interface/program (margin targets, assumptions, and waiver rationale).
  • Analyze and optimize high-speed channels (PCIe, DDRx, Ethernet, MIPI/SerDes) for loss, crosstalk, reflections, jitter, and margin.
  • Partner with architecture and board teams to drive interface trade-offs and risk reductions early in design.
  • Signal Integrity Analysis & Design Enablement
  • Design and validate PDN across VRMs, planes, vias, and decoupling to meet target impedance and transient response goals.
  • Support power-up and load-step planning with system/SoC teams to ensure robust operation across use cases.
  • Maintain reusable SI/PI model library and simulation-to-measurement correlation reports; publish updated design rules/guard-bands.
  • Build and maintain SI/PI models (S-parameters, IBIS/IBIS-AMI, SPICE) and run what-if studies to predict risk before hardware build.
  • Produce lab measurement and correlation reports (eye/jitter/BER, PDN impedance/noise) and support pre-compliance EMI/EMC debug as needed.
  • Perform characterization using oscilloscopes, TDR, VNA, high-speed probing, and automated margining where applicable.

Skills

  • Collaboration across global, cross-functional teams and suppliers; comfortable working across time zones.
  • Lab proficiency with high-bandwidth oscilloscopes, TDR, VNA, probes/fixtures, and correlation of measurement to simulation.
  • Experience with advanced packaging or module integration (SoC package escape, connector/cable assemblies, harness considerations).
  • ​Required Specialized
  • Experience working with SoC vendors (e.g., Qualcomm, NVIDIA) on interface tuning, margining, and bring-up debug.
  • Background with scripting/automation for data analysis (Python, MATLAB) and reporting of SI/PI metrics. </

Compensation

  • We are CARIAD, an automotive software development team with the Volkswagen Group.
  • Our mission is to make the automotive experience safer, more sustainable, more comfortable, more digital, and more fun.
  • To achieve that we are building the leading tech stack for the automotive industry and creating a unified software platform for over 10 million new vehicles per year.
  • We're looking for talented, digital minds like you to help us create code that moves the world.
  • Together with you, we'll build outstanding digital experiences and products for all Volkswagen Group brands that will transform mobility.
  • Join us as we shape the future of the car and everyone around it.
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This listing is sourced directly from Cariadinc's careers page and normalized into a canonical job model.