Nexperia
Package Architect
Dallas · Full-time
Sponsorship not specifiedDetected 30 days ago
Data AnalysisProject ManagementRecruitingIntellectual PropertyMechanical Design
About the role
- Package Architect, Nexperia USA Inc., Richardson, TX: Subject matter expert on semiconductor packaging and assembly.
- Formulate package strategy and roadmap esp for Product Group "Low Power Distribution & Protection (MAG R04)".
- Accountable to act as recognized leader within the site and/or BG as expert in Packaging.
Responsibilities
- Responsible for functionality & performance of the package design.
- Accountable to build up and broaden own competencies, to influence direction on BG level.
- Lead cross-functional teams for NPI-package related projects.
- Generation of new design concepts and patent ideas.
Requirements
- 7 years of experience with semiconductor packages, semiconductor assembly materials, and semiconductor assembly processes;
- 7 years of experience with 6sigma-methodology including DoE and Data Analysis;
- 7 years of experience with semiconductor reliability tests and failure modes
- 5 years of experience with Project Management in the semiconductor industry.
- Bachelor's degree in Electronics Engineering, Mechanical Design, Physics, Materials, or a related field and 8 years of progressive, post-baccalaureate work experience.
- Of the required experience, must have experience in all the following:
- International travel required up to 5%
- Domestic travel required up to 5%.
Company info
- Responsible to advise internal and external customers in own field of expertise.
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This listing is sourced directly from Nexperia's careers page and normalized into a canonical job model.