Micron
Intern - Engineer, HIG HBM DTPCO
Richardson, TX · Intern · Internship
Sponsorship not specifiedDetected 15 days ago
PythonC++CData AnalysisLLMsAgentic AIVerilogElectrical EngineeringCommunicationProblem SolvingAdaptability
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odds of building a lasting career here
42Risky
Cap-exempt (no lottery)0
Sponsors this role100
Entry-level history0
PERM / green-card track0
Lottery odds40
Fits your clock70
Thin sponsorship signal and lottery-bound. A low-probability bet with your clock running. Prioritize cap-exempt roles and proven entry-level sponsors first.
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from this employer's Department of Labor filings
Green-card filing pattern in this occupation
Context, not a finding about this posting: of this employer's 143 green-card filings in this occupation, 99% were for a worker who already held the job.
Green-card follow-through: 87%
Of 138 labor certifications old enough to have been used, 18 expired without the employer filing the next step. Median time from filing to decision: 496 days.99% of their filings were for a worker who already held the job.Only certifications past the 180-day window are counted — recent ones cannot have expired yet.
Files H-1B transfers
37 transfer filings in the last year, covering 37 workers. Median labor-condition decision: 7 days. An employer that already files transfers is one that can take over an existing H-1B.
Sourced from Department of Labor LCA, PERM and prevailing-wage disclosure data. Employer matching is by name, so figures may be split across an employer's legal entities. Absence of a filing means none appears in our copy of the data, not that none exists.
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About the role
- Our vision is to transform how the world uses information to enrich life for all.
- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsibilities
- Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards.
- Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, timing margin evaluation, and failure-onset analysis.
- Develop and maintain Python-, Verilog-, and C/C++-based test programs, stress patterns, workloads, and observability features to accelerate root-cause investigations and improve characterization efficiency.
- Analyze MBIST signatures and multifaceted electrical, thermal, and mechanical datasets to identify root causes related to design, process, package, assembly, or test interactions, and recommend corrective actions.
- The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality.
- This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models.
Requirements
- Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
- 3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field.
- Hands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware.
- Programming experience in Python and at least one additional language such as C/C++ or Verilog.
- Experience analyzing complex datasets and driving root-cause investigations using statistical and engineering methods.
Nice to have
- Master's or PhD degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field.
- Experience with DRAM, HBM, memory subsystems, advanced semiconductor packaging, or silicon characterization.
- Knowledge of thermal, mechanical stress, reliability, yield improvement, DOE methodologies, and power-performance correlation techniques.
- Experience working with MBIST analysis, parametric characterization, failure signatures, and semiconductor test methodologies.
- Proficiency using AI-enabled tools, Agentic AI, Generative AI, or AI-assisted coding platforms (e.g., Claude Code, Code Assist) to improve engineering productivity, data analysis, and workflow automation.
- Micron is proud to be an equal opportunity workplace and is an affirmative action employer.
- To learn about your right to work click here.
- To learn more about Micron, please visit micron.com/careers
Company info
- Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis.
- We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Visa & Work Authorization
- ve consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protec
This listing is sourced directly from Micron's careers page and normalized into a canonical job model.