Powerlattice Inc
Power Delivery Solution Architect
Chandler, AZ · Staff+
Sponsorship not specified$180k-$250kDetected 13 days ago
CommunicationOrganizational Skills
About the role
- PowerLattice is responsible for designing the chiplet for customers, which in turn saves power.
- This role offers significant opportunity for impact, ownership, and growth, contributing directly to both customer product success and PowerLattice's commercial momentum.
- This position is well suited for someone who thrives in a fast-paced startup environment, anticipates needs before they arise, and enjoys being a trusted technical advisor to customers and internal teams alike.
Responsibilities
- Enable customer to design GPU/CPU SoC power solution with PowerLattice's chiplet
- Assist customer's PDN design optimization using PowerLattice's design kit
- Maintain strict confidentiality and handle sensitive technical information with discretion
- Hands-on experience extracting, building, and validating SoC package electrical models
Requirements
- 8+ years of experience in power integrity and/or signal integrity for high-performance SoCs
- Exceptional proficiency in power integrity or signal integrity tool chain and simulation flow
- Strong experience with package-level PI/SI, including substrates, interposers, and advanced packaging (2.5D / 3D)
- Deep proficiency with PI/SI simulation tools and analysis workflows
- Excellent written and verbal communication skills, with the ability to engage directly with customer engineering teams
- Hands-on experience with electrical test methodologies and instrumentation for power integrity or signal integrity
- Experience in advanced package technologies, e.g. CoWoS, 2.5D
Compensation
- Anticipated annual base salary for Member of Technical Staff: $180,000 - $250,000
Benefits
- Stock option grant
- Comprehensive benefits package including health, dental, vision, and 401(k)
Company info
- PowerLattice is a well-funded semiconductor startup backed by leading Silicon Valley venture capital firms.
- We are developing a groundbreaking chiplet solution for a fundamental shift in how high-performance chips are powered, paving the way for the next generation of AI and advanced computing.
- We are the first to offer a tiny device that can be integrated into a SoC package.
- Act as a primary technical point of contact for tier-one customers
- Assist customers through the full adoption lifecycle, from early modeling through physical design and system bring-up
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