meshopticaltechnologies

meshopticaltechnologies

High Speed Photonic Integrated Circuit Designer

Gardena, CA

Sponsorship not specified$160k-$190kDetected 35 days ago
PythonMATLABData AnalysisSEMANSYSPCB DesignElectrical EngineeringCOMSOLCommunication

About the role

  • HIGH SPEED PHOTONIC INTEGRATED CIRCUIT DESIGNER
  • Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that's exactly what we're doing at Mesh.

Responsibilities

  • Design, simulate, and optimize high-speed electro-optic modulators and integrated photonic circuits across silicon photonics and III-V platforms (e.g., InP/InGaAsP), with applications spanning advanced coherent and IM/DD transmitters
  • Drive photonic tape-outs end-to-end, including circuit design, DOE planning, hands-on layout, foundry interfacing, and coordination with packaging and electronic driver stakeholders
  • Own device, circuit, and system modeling workflows using industry tools (e.g., Lumerical Mode/FDTD/Interconnect, BeamPROP, HFSS, ADS/Ansys Designer, VPI), and develop models that incorporate process variation and fab non-idealities
  • Lead RF, signal integrity, and high-speed interconnect design from die to carrier/package/PCB, including co-design of chip, carrier, RF package, and chip-on-carrier interconnects
  • Partner with driver and packaging teams/suppliers to optimize end-to-end modulator + driver performance, including impedance matching, bandwidth, voltage swing, and power/thermal constraints
  • Define design-for-test strategies and collaborate with test and assembly teams to plan and execute automated, high-volume characterization and assembly-level validation
  • develop new test methods as needed
  • Analyze measurement results (e.g., EO S-parameters/S21, eye diagrams, mask margin, RIN, chirp) and correlate test and physical data (including SEM/fab feedback) to models to drive root-cause analysis and performance improvement
  • Lead RF, signal integrity, and high-speed interconnect design from die to carrier/package/PCB, including co-design of chip, carrier, RF package, and chip-on-carrier interconnects; identify and resolve signal integrity issues across the link
  • Define design-for-test strategies and collaborate with test and assembly teams to plan and execute automated, high-volume characterization and assembly-level validation; develop new test methods as needed

Requirements

  • Proficiency with photonic simulation tools (e.g., Ansys Lumerical
  • Working knowledge of RF fundamentals and signal integrity
  • experience with EM/SI simulation tools (e.g., HFSS, ADS, Ansys Designer)
  • Strong communication skills and ability to work independently in a fast-moving, cross-functional team
  • Experience with chip-to-package co-design: chip-on-carrier/RF packaging, high-speed interconnect design, and PCB-to-package SI closure
  • Experience correlating models to characterization and physical metrology (e.g., wafer/process variation modeling, SEM correlation, fab issue root-cause)
  • Familiarity with high-speed characterization methods and test metrics (e.g., S-parameters, time-domain large-signal measurements, eye/mask, RIN, chirp) and experience defining testability and automated test strategies
  • Understanding and/or hands-on experience with photonic packaging and photonic-electronic interfaces (drivers, TIAs, etc.)
  • Experience with system-level simulation for optical links and transmitters (e.g., VPI, ADS, Interconnect)
  • Master's or PhD in electrical engineering, applied physics, optical engineering, or a related discipline
  • 3+ years of industrial experience in integrated photonics, including design and modeling of passive and active components with emphasis on electro-optic phase shifters/modulators
  • Proficiency with photonic simulation tools (e.g., Ansys Lumerical; COMSOL, Tidy3D/Meep, or similar) and familiarity with photonic circuit modeling (e.g., Interconnect/SAX or equivalent)
  • Working knowledge of RF fundamentals and signal integrity; experience with EM/SI simulation tools (e.g., HFSS, ADS, Ansys Designer)
  • Photonic layout and tapeout experience (e.g., IPKISS, GDSFactory, or similar) and understanding of foundry processes and design rules
  • Strong programming and data analysis skills (e.g., Python and/or MATLAB) for automation, visualization, and data-driven design decisions
  • Willingness to work extended hours and weekends as needed

Nice to have

  • Demonstrated experience designing high-speed photonic devices (10+ GHz bandwidth and beyond preferred) and understanding key transmitter architectures (e.g., PAM4, coherent formats)

Skills

  • At the heart of next-generation optical links are high-speed electro-optic modulators and transmitters pushing tens of gigahertz and beyond.

Compensation

  • High Speed Photonic Integrated Circuit Designer: $160,000.00 - $190,000.00/per year
  • Title and base salary are determined on a case by case basis commensurate with experience and merit.
  • In addition to base salary, compensation for this role includes:
  • Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
  • Relocation assistance to sunny Los Angeles.

Benefits

  • Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
  • Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
  • Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
  • 401(k) retirement plan access.
Apply directly at meshopticaltechnologies →Create a free account for alerts like thisView meshopticaltechnologies immigration profile

This listing is sourced directly from meshopticaltechnologies's careers page and normalized into a canonical job model.