NXP Semiconductors
Chip Lead
Austin (Oakhill, Office)
Sponsorship not specifiedDetected 30 days ago
Electrical EngineeringCollaboration
About the role
- Work with Systems, Marketing, PE/TE and Arch engineering to define the part.
- Generate and analyze data to take right and cost effective architecture decision
- Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.
Responsibilities
- Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.
- Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.
Requirements
- Experience in leading Global cross functional teams
- During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.
- Bachelors in Engineering with at 15 years of design development experience, with at least 5 years of leading complete design and design functions.
- MS in Electrical Engineering preferred (higher level education may substitute for some experience).
- Experience in leading designs in smaller geometries desired
Equal opportunity
- The role is based in Austin/US. This is a hybrid role with a few days in the office each week and the remaining days are work from home.
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