SK hynix America
Advanced Package Design Engineer
San Jose, CA
Sponsorship not specified$110k-$155kDetected 2 days ago
Machine LearningANSYSPCB DesignMechanical DesignElectrical EngineeringCommunication
About the role
- You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions.
Responsibilities
- Design silicon and organic interposers for advanced packaging solutions
- Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
- Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
- Create and maintain layout design rules, stack-ups, and layout guidelines
- Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development
- Advanced Package Design Engineer
- You'll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions
Requirements
- 3+ years of experience in semiconductor package design or layout
- Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
- Effective communication skills and ability to work in a fast-paced, cross-functional environment
- Understanding of high-speed signal routing, power distribution networks (PDN)
- Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
Nice to have
- Currently pursuing a PhD's degree in Electrical Engineering or a related field
- Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
- Proven understanding of high-speed signal routing, power distribution networks (PDN)
- Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques
- Bachelor's or Master's degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
Skills
- About SK hynix America
Compensation
- Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets.
- Pay within the provided range varies by work location and may also depend on job-related skills and experience.
- Your Recruiter can share more about the specific salary range for the job location during the hiring process.
- $110,000 - $155,000 USD
Benefits
- Top Tier health insurance at no employee cost
- Paid day offs: PTO + Company Holidays + Happy Fridays
- Paid Parental Leave Program
- Educational reimbursement up to $10,000 per year
Company info
- We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America.
Equal opportunity
- SKHYA is an Equal Employment Opportunity Employer.
- We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
- Compensation:
- Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets.
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