Semtech

Associate Packaging Engineer

CAN - Burlington, ON

Sponsorship not specified$70k-$75kDetected 14 days ago

SAPRecruitingPCB DesignCadenceElectrical EngineeringVoIPCommunicationProblem Solving

About the role

Packaging engineers are responsible for designing the case - also known as the "package" - that encapsulates a semiconductor integrated circuit (IC), protecting it against external factors and providing adequate interconnect points to printed circuit boards.
This discipline draws on multiple engineering skills including manufacturing, electrical, mechanical, thermal, and reliability engineering.

Select and manage raw material inventory
Track quality deviations and drive disposition and resolution
Understanding of design implications related to JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) is a definite advantage.

Bachelor's degree in Mechanical or Industrial Engineering, or 5+ years of experience in a relevant electronic manufacturing environment.
Demonstrated experience or strong aptitude with manufacturing systems such as SAP and Agile.
Experience with the following packaging technologies: WLCSP, RDL, flip-chip Ball Grid Array (BGA), System in Package (SiP), high-density substrate, and PCB design.
Experience with EDA design tools such as Cadence Advanced Package Designer v16.6, Artwork Qckvu v3.51, Asitic, and DraftSight is beneficial.
Incumbents may be required to perform job-related tasks other than those specifically included in this description.

Strong analytical and problem-solving skills with excellent attention to detail.
Master's degree in Mechanical, Electrical, or Industrial Engineering preferred.
Prior experience in a semiconductor packaging or assembly environment.
Desired Qualifications
The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job.

This listing is sourced directly from Semtech's careers page and normalized into a canonical job model.