Lyte
Packaging and Assembly lead
Sunnyvale, CA
Sponsorship not specifiedDetected 22 days ago
Data AnalysisProject ManagementProcess ImprovementRoboticsMechanical DesignElectrical EngineeringSensors
About the role
- Act as the technical program manager for operation process team.
- Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
- Write technical reports and present results to internal and external stakeholders.
Responsibilities
- Communicate with the RnD team to understand the design targets, existing specs, and existing process flow, process maturity, and its related yield for each process step.
- Lead the tradeoff between the design and process.
- Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture.
- Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase.
- Develop and maintain packaging and component specifications as well as inventory tracking.
- Build and grow the Operation Process Team worldwide.
- Drive Cp, Cpk, and yield improvement.
- For more information, visit www.lyte.ai If you're excited about building impactful technology in a dynamic, hands-on environment, we'd love to hear from you!
- Lead process integration check to ensure the upstream process will not affect the downstream process yield.
- Preferred Qualifications Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable.
Requirements
- Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience.
- Experience with process integration for process flow design and continue process improvement.
- Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important.
- Experience with FMEA, failure analysis, and 8D report.
- Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.
- Required Qualifications Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience.
Nice to have
- Familiar with data analysis software such as JMPs is a plus.
- Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus.
- Experience with PCBA process is highly desirable.
- Understanding Silicon Photonics is a plus.
- Experience in IIIV wafer process, bar level process, and CoC packaging is a plus.
- Supplier quality management experience is a plus.
- Knowledge of Lidar and relevant technologies is a plus.
- Former experience of writing technical SoW is a plus.
This listing is sourced directly from Lyte's careers page and normalized into a canonical job model.