credosemi

credosemi

Senior Opto-Mechanical Engineer

Kanata, Ontario · Senior

Sponsorship not specifiedDetected 10 days ago
SolidWorksFEAThermal AnalysisMechanical DesignElectrical EngineeringCommunicationCollaborationProblem Solving

About the role

  • Credo is seeking a Senior Opto-Mechanical Engineer to join our Core Technology Development (CTD) team.
  • This is a hands-on, product development-focused engineering role ideal for someone passionate about designing high-volume systems.

Responsibilities

  • Design and integrate optical assemblies and sub-assemblies.
  • Develop mechanical architecture, thermal management strategies, strain relief processes, and process flows for high-density optoelectronic packages.
  • Lead FEA analysis (thermal, stress, shock/vibration) and define materials and tolerances for epoxies, reflow, and thermal cycling.
  • Drive process de-risking and design-for-manufacturing (DFM) efforts from prototype through volume production.
  • Create and maintain design documentation, 3D models, and assembly drawings using SolidWorks and ANSYS.
  • analyze measurement data to inform design decisions.
  • Oversee experimental work related to thermal, mechanical, and environmental qualification of optical products; analyze measurement data to inform design decisions.

Requirements

  • Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a related field with a focus on packaging and mechanical analysis.
  • Minimum 5 years of industry experience in packaging development for communication applications.
  • 4-5 years of experience in high-speed electronics and optical package design.
  • Proven expertise in optical fiber and component packaging for communication systems.
  • Demonstrated proficiency in thermal design and testing.

Nice to have

  • Master's or Ph.D. in a related field with experience in optical and communication industries.
  • Experience in system-level packaging assembly development.
  • Credo is an Equal Opportunity Employer.

Skills

  • Credo is engineering the future of high-speed connectivity for the AI-driven world.

Company info

  • You will collaborate with a global team of experts in semiconductor micro-devices and communication systems to co-develop novel packaging concepts with vendor partners.
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