Micron

Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

Boise, ID - ID1, USA · Principal

Sponsorship not specified$20k-$50kDetected 15 days ago

Data AnalysisElectrical EngineeringLeadershipCommunicationCollaborationProblem Solving

About the role

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
You will work closely with teams across the U.S., Japan, Taiwan, and Singapore to meet aggressive performance, quality, and reliability targets.

Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
Integrate and drive execution of cross‑site project data (design, test, yield, manufacturing) to closure.
Deliver yield improvements through end‑to‑end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
Lead cross‑functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy best‑known methods (BKMs) and business processes to improve productivity.
Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment.
Lead cross‑functional, global task forces to resolve yield and quality issues efficiently.
Develop, standardize, and deploy best‑known methods (BKMs) and business processes to improve productivity.
Communicate status, risks, and technical proposals clearly and partner with leadership to drive results.
Travel to Micron fab and development sites as needed to support execution and alignment.

Bachelor's, Master's, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.

Experience with DRAM High Bandwidth Memory (HBM) products.
Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout topics.
Strong interest in innovation, continuous improvement, and scalable solution development.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer.
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To learn more about Micron, please visit micron.com/careers
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

ve consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protec

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