Lightmatter

Lightmatter

Package Layout Engineer

Mountain View, CA · Mid · Full-time

Sponsorship not specified$157k-$176kDetected 57 days ago
PythonValuationAltiumCadenceElectrical EngineeringCommunication

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odds of building a lasting career here

53Sponsors, lottery-bound
Cap-exempt (no lottery)0
Sponsors this role58
Entry-level history0
PERM / green-card track0
Lottery odds (Level IV)94
Fits your clock70

Sponsors, but it's cap-subject — you still face the weighted lottery (~61% per draw at Level IV). Good if you win; have a cap-exempt backup on your list.

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Employer immigration record

from this employer's Department of Labor filings

Files H-1B transfers

10 transfer filings in the last year, covering 10 workers. Median labor-condition decision: 28 days. An employer that already files transfers is one that can take over an existing H-1B.

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About the role

  • This position offers a unique opportunity to work on new package architectures by solving complex interactions across digital, analog and photonics domains.

Responsibilities

  • Deliver IC package substrate layouts for standard and advanced packaging technologies.
  • Contribute to the product concept phase by delivering preliminary substrate designs and floorplanning to support overall stack-up (Silicon/package/MB) optimization.
  • Collaborate with package substrate suppliers and Outsourced Semiconductor Assembly and Test (OSAT) companies to apply layout design rules, stack up, and implementation guidelines.
  • Generate fab files and coordinate with substrate suppliers and OSATs to support Design for Manufacturing (DFM) and Design for Assembly (DFA) closure.
  • Design package layouts while adhering to signal integrity, power integrity, thermal, and mechanical requirements.
  • Design packages incorporating analog and digital elements/interfaces.
  • Support signal/power integrity engineers by providing iterative test routes to refine design rules and routing topologies.
  • Coordinate across functional teams to execute error-free Package Design Tape Outs on schedule.
  • Support and adapt design automation and verification activities to improve team efficiency.

Requirements

  • B.S. or M.S. degree in Electrical Engineering or similar discipline with at least 5 years of relevant experience
  • Minimum 3-5 years of experience in IC package layout design.
  • Proficient with Allegro X APD.
  • Understanding of IC package substrates and organic materials, and their impact on package design.

Nice to have

  • Familiarity with system-level validation tools such as Cadence Integrity 3DIC for package/IC codesign.
  • Familiarity with layout tools (e.g., Expedition Package Designer, Pads Layout, Altium, etc.).
  • Experience with layout tool scripting languages (e.g., SKILL or Python) to enable design automation.

Compensation

  • total compensation goes beyond base salary, it also includes a new hire equity grant, annual performance-based equity, and other rewards that recognize your impact and contribution.
  • $157,000 - $176,000 USD

Benefits

  • Comprehensive Health Care Plan (Medical, Dental & Vision)
  • Retirement Savings Matching Program
  • Life Insurance (Basic, Voluntary & AD&D)
  • Generous Time Off (Vacation, Sick & Public Holidays)
  • Paid Family Leave
  • Short Term & Long Term Disability
  • Commuter Benefits
  • Equity grants (applicable to full-time employees)
  • Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.
  • Flexible, hybrid workplace model

Visa & Work Authorization

  • Export Control

This listing is sourced directly from Lightmatter's careers page and normalized into a canonical job model.