Analog Devices

Analog Devices

FIB Technician

US, OR, Beaverton

Sponsorship not specified$38k-$53kDetected 21 days ago
SEMRoboticsElectrical EngineeringCommunication

About the role

  • About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge.
  • With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible.
  • Learn more at www.analog.com and on LinkedIn and X.

Responsibilities

  • Perform FIB cross-sections and SEM imaging to evaluate process integrity, defect mechanisms, and structural characteristics on semiconductor devices.
  • Support additional sample-preparation approaches, including S-TEM lift-out, as needed and as experience develops.
  • Support the Production Fab through rapid physical analysis for tool and process qualification, lines down events, uncontained excursions, scrap disposition, and other high-priority production issues.
  • Manage work from the online request system by interpreting analysis needs, selecting appropriate approaches, identifying when additional techniques may be helpful, and clarifying ambiguous or incomplete requests directly with requestors.
  • Partner with fab, process, product, and failure analysis teams to identify root cause, contain issues, and communicate clear analytical findings, risks, and recommendations to engineering stakeholders.
  • Maintain equipment, workflow readiness, and compliance with lab safety, cleanroom protocols, and operating standards while driving improvements in throughput, repeatability, and data quality.
  • Ability to manage ambiguous or incomplete requests by asking clarifying questions, interacting effectively with requestors, and prioritizing work based on urgency, technical need, and fab impact.
  • Strong written and verbal communication skills, with the ability to work effectively in a fast-paced fab support environment and clearly communicate technical findings to cross-functional engineering teams.

Requirements

  • Minimum associate's degree, technical certification, or equivalent hands-on experience in Materials Science, Electrical Engineering Technology, Physics, Chemical Engineering Technology, or a related technical field
  • Hands-on experience with FIB cross-sectioning and SEM imaging in a semiconductor production, process characterization, or failure analysis environment.
  • Required Travel: No

Compensation

  • $38k-$53k

Benefits

  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
  • relevant semiconductor lab or failure analysis experience may be considered in lieu of formal education.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

Equal opportunity

  • Notice of Applicant Rights Under the Law.
  • equal opportunity employer.
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